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NUF4107FCT1

Onsemi

NUF4107FCT1 by Onsemi

NUF4107FCT1 by Onsemi is a Data Line Filter with 4 functions. It has a max operating temperature of 85 °C and min of -40°C. With dimensions of L2.96xB1.33xH0.74 (mm), it is ideal for surface mount applications requiring a capacitance of 60uF.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,429 parts In-Stock

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Digiode

USA . 850 parts In-Stock

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850

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SupplyDigital Components

Austria . 6,028 parts In-Stock

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Kulean Microsystems

USA . 5,438 parts In-Stock

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Problanco Electronics

Mexico . 3,584 parts In-Stock

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Corphita

USA . 2,197 parts In-Stock

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TANS Electronics

Latvia . 1,407 parts In-Stock

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Corohmni

South Africa . 477 parts In-Stock

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UHIMA Technologies

Türkiye . 115 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NUF4107FCT1 Data Line Filter by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality filters that offer reliable protection against interference and noise, ensuring seamless data transmission. Perfect for a wide range of applications, this filter is designed to meet the demands of modern technology. With its compact size and advanced features, the NUF4107FCT1 provides unmatched value, delivering superior performance and lasting benefits to customers looking for a reliable solution to enhance their electronic systems. Trust Onsemi to elevate your electronic experience with the NUF4107FCT1 Data Line Filter.

Feature Benefit Bullets

No. of Functions: 4

Having 4 functions allows for multiple filtering capabilities, making it versatile for various applications.

Filter Type: DATA LINE FILTER

Specifically designed for data lines, ensuring excellent noise filtering and signal integrity.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, suitable for a wide range of operating conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead finish provides good solderability and durability for reliable connections.

Width (mm): 1.33

Compact size enables easy integration into electronic circuits with limited space.

Maximum DC Resistance: 120 ohm

Low resistance helps maintain signal integrity and efficiency in data transmission.

Length: 2.96 mm

Optimal length for effective filtering while maintaining a small footprint.

Packing Method: TAPE AND REEL

Convenient packaging for automated assembly processes, increasing efficiency.

Mounting Type: SURFACE MOUNT

Surface mount design saves space and simplifies PCB layout for easier installation.

Dimensions: L2.96XB1.33XH0.74 (mm)

Compact dimensions offer flexibility in placement within electronic devices.

Package Material: PLASTIC

Durable plastic material ensures protection and longevity of the filter component.

Height: 0.74 mm

Low profile design minimizes height constraints in electronic assemblies.

Capacitance: 60 uF

Capable of storing and releasing electrical energy, enhancing filtering performance.

Technical Specifications

Data Line Filters NUF4107FCT1 attributes and parameters. Explore more Data Line Filters devices from Onsemi

Specs

Additional Features:

PI TYPE CIRCUIT

Capacitance:

60 uF

Maximum DC Resistance:

Filter Type:

Height:

.74 mm

JESD-609 Code:

e0

Length:

2.96 mm

Mounting Type:

SURFACE MOUNT

No. of Functions:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Material:

PLASTIC

Packing Method:

TAPE AND REEL

Dimensions:

L2.96XB1.33XH0.74 (mm)

Sub-Category:

Data Line Filters

Terminal Finish:

Tin/Lead (Sn/Pb)

Width (mm):

1.33

Trade Compliance

NUF4107FCT1 Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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