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NUF2101MT1

Onsemi

NUF2101MT1 by Onsemi

NUF2101MT1 by Onsemi is a Data Line Filter with 6 terminals. It operates b/w -55 °C to 125°C, has a DC resistance of 33.7 ohm, and capacitance of 55 uF. Ideal for surface mount applications requiring data line filtering in compact spaces.

Median Price

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Lifecycle Status

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4

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1k+

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Chip Stock

USA . 25,000 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

Germany . 929 parts In-Stock

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AZTECH Wire

Italy . 543 parts In-Stock

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SupplyDigital Components

Austria . 6,714 parts In-Stock

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Problanco Electronics

Mexico . 6,366 parts In-Stock

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TANS Electronics

Latvia . 3,102 parts In-Stock

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Kulean Microsystems

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Corphita

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Corohmni

South Africa . 377 parts In-Stock

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UHIMA Technologies

Türkiye . 30 parts In-Stock

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Overview

Enhance the performance and reliability of your electronic devices with the NUF2101MT1 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and cutting-edge technology in their Data Line Filters. Perfect for applications requiring noise suppression and signal integrity, this filter offers unmatched value and benefits to customers. Say goodbye to interference and hello to seamless connectivity with the NUF2101MT1. Elevate your electronics with Onsemi's superior products today.

Feature Benefit Bullets

No. of Terminals: 6

More terminals provide flexibility in connection options and allow for a wider range of applications.

Filter Type: DATA LINE FILTER

Specifically designed for filtering data lines, ensuring clean and reliable signal transmission.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures without compromising performance, suitable for various environments.

Minimum Operating Temperature: -55 °C

With a wide temperature range, this filter can function in extremely cold conditions as well.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead finish provides good conductivity and solderability for efficient connections.

Width (mm): 1.7

Compact width enables easy integration into circuit layouts with limited space.

Maximum DC Resistance: 33.7 ohm

Low resistance ensures minimal power loss and efficient filtering performance.

Length: 3.1 mm

Optimal length for the intended data line filtering function, maintaining signal integrity.

Packing Method: TAPE AND REEL

Convenient packaging method for automated assembly processes, reducing manual handling.

Mounting Type: SURFACE MOUNT

Surface mount design simplifies PCB assembly and offers space-saving benefits.

Dimensions: L3.1XB1.7XH1.1 (mm)/L0.122XB0.067XH0.043 (inch)

Compact dimensions make this filter suitable for small electronic devices or densely populated PCBs.

Package Material: PLASTIC

Durable plastic material protects the filter components and ensures long-term reliability.

Height: 1.1 mm

Low profile height allows for installation in slim devices or tight spaces.

Capacitance: 55 uF

Suitable capacitance value for effective filtering of data lines and suppression of unwanted signals.

Technical Specifications

Data Line Filters NUF2101MT1 attributes and parameters. Explore more Data Line Filters devices from Onsemi

Specs

Capacitance:

55 uF

Maximum DC Resistance:

Filter Type:

Height:

1.1 mm

JESD-609 Code:

e0

Length:

3.1 mm

Mounting Type:

SURFACE MOUNT

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Material:

PLASTIC

Packing Method:

TAPE AND REEL

Dimensions:

L3.1XB1.7XH1.1 (mm)/L0.122XB0.067XH0.043 (inch)

Sub-Category:

Data Line Filters

Terminal Finish:

Tin/Lead (Sn/Pb)

Width (mm):

1.7

Trade Compliance

NUF2101MT1 Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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