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NUF2101W1T1

Onsemi

NUF2101W1T1 by Onsemi

NUF2101W1T1 by Onsemi is a DATA LINE FILTER with max temp of 125 °C and min temp of -55°C. It has a DC resistance of 33 ohm, dimensions L2.2xB1.35xH1.1 mm, suitable for surface mount applications in data line filtering.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,478 parts In-Stock

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Digiode

USA . 2,073 parts In-Stock

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TANS Electronics

Latvia . 5,840 parts In-Stock

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SupplyDigital Components

Austria . 2,517 parts In-Stock

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Corphita

USA . 1,511 parts In-Stock

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Kulean Microsystems

USA . 980 parts In-Stock

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UHIMA Technologies

Türkiye . 608 parts In-Stock

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Corohmni

South Africa . 163 parts In-Stock

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Problanco Electronics

Mexico . 5 parts In-Stock

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Overview

Enhance the performance and reliability of your electronic devices with the NUF2101W1T1 Data Line Filter by Onsemi. Manufactured with precision and expertise, this filter offers superior quality and efficiency in managing data line signals. Ideal for a wide range of applications, this product ensures smooth and uninterrupted data transmission while protecting your devices from electrical interference. Trust in Onsemi to deliver exceptional products that provide value, benefits, and advantages to customers seeking top-notch performance in their electronic systems.

Feature Benefit Bullets

Filter Type: DATA LINE FILTER

This filter is specifically designed for data lines, ensuring optimal signal quality and reducing interference.

Maximum Operating Temperature: 125 °C

This high maximum operating temperature ensures the filter can withstand heat stress and maintain performance in various environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the filter to function effectively even in extremely cold conditions.

Maximum DC Resistance: 33 ohm

The low DC resistance helps in maintaining signal integrity and reducing loss in data transmission.

Length: 2.2 mm

Compact length makes this filter suitable for applications where space is limited.

Packing Method: TAPE AND REEL

The tape and reel packaging method facilitates automated assembly processes, saving time and ensuring efficiency.

Mounting Type: SURFACE MOUNT

Surface mounting type offers easy installation and secure placement on circuit boards.

Dimensions: L2.2XB1.35XH1.1 (mm)/L0.087XB0.053XH0.043 (inch)

Compact dimensions make this filter suitable for small electronic devices and integrated circuits.

Height: 1.1 mm

Low height profile allows for easy integration into compact electronic designs without adding bulk.

Technical Specifications

Data Line Filters NUF2101W1T1 attributes and parameters. Explore more Data Line Filters devices from Onsemi

Specs

Maximum DC Resistance:

Filter Type:

Height:

1.1 mm

Length:

2.2 mm

Manufacturer Series:

NUF2101W1T1

Mounting Type:

SURFACE MOUNT

No. of Functions:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Packing Method:

TAPE AND REEL

Dimensions:

L2.2XB1.35XH1.1 (mm)/L0.087XB0.053XH0.043 (inch)

Trade Compliance

NUF2101W1T1 Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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