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NTLLD4951NFTWG

Onsemi

NTLLD4951NFTWG by Onsemi

NTLLD4951NFTWG by Onsemi is an N-CHANNEL Power FET with 13A max drain current and 3.2W max power dissipation. Ideal for applications requiring high power efficiency in a compact form factor, such as power supplies and motor control systems. Operating in enhancement mode, it offers reliable performance up to 150 °C with surface mount capability for easy integration.

Median Price

$1.413

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$1.360

1k+ parts

$1.130

10k+ parts

$1.010

3,000

-

$1.360

$1.130

$1.010

DigiKey

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.700

10k+ parts

-

3,000

-

-

$1.700

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Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.413

10k+ parts

$1.262

3,000

-

-

$1.413

$1.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 948 parts In-Stock

1+ parts

$1.112

100+ parts

-

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948

$1.112

-

-

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Chip Stock

USA . 35,000 parts In-Stock

1+ parts

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35,000

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Vyrian

USA . 12,723 parts In-Stock

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12,723

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Distributors (Availability)

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Corohmni

South Africa . 400 parts In-Stock

1+ parts

$0.981

100+ parts

-

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400

$0.981

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-

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Corphita

USA . 1,337 parts In-Stock

1+ parts

$1.053

100+ parts

-

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1,337

$1.053

-

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Component Stockers USA

USA . 4,230 parts In-Stock

1+ parts

$1.190

100+ parts

$1.120

1k+ parts

$1.010

10k+ parts

-

4,230

$1.190

$1.120

$1.010

-

AZTECH Wire

Italy . 62 parts In-Stock

1+ parts

$22.140

100+ parts

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62

$22.140

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TANS Electronics

Latvia . 8,196 parts In-Stock

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8,196

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Kulean Microsystems

USA . 8,037 parts In-Stock

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8,037

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Microchip USA

USA . 5,704 parts In-Stock

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5,704

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SupplyDigital Components

Austria . 5,075 parts In-Stock

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5,075

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QUARKTWIN TECHNOLOGY LTD

USA . 3,750 parts In-Stock

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3,750

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Continental Prestige Electronics

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

$1.400

1k+ parts

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3,000

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$1.400

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UHIMA Technologies

Türkiye . 242 parts In-Stock

1+ parts

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242

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Problanco Electronics

Mexico . 151 parts In-Stock

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151

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Overview

Enhance your power management solutions with the NTLLD4951NFTWG from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability, ensuring optimal performance for your applications. Whether you're looking to improve efficiency in power supplies, motor control, or lighting, this N-CHANNEL Power Field Effect Transistor offers enhanced mode operation and high drain current capabilities. Trust Onsemi to provide value and innovation with every product, giving you the competitive edge you need in today's fast-paced market.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally have better performance and higher efficiency compared to P-CHANNEL FETs, making this product a good choice for applications requiring high power handling.

Surface Mount: YES

Surface mount technology allows for easy and compact installation on circuit boards, making it suitable for space-constrained applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to use and control in circuits, providing better overall performance and efficiency.

Maximum Drain Current (Abs): 13 A

With a high maximum drain current rating, this FET can handle heavy loads without overheating, ensuring reliable operation.

Maximum Power Dissipation (Abs): 3.2 W

The low power dissipation of this FET results in minimal heat generation, leading to improved efficiency and longevity of the product.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer high switching speeds and low on-state resistance, making them ideal for high-frequency and high-power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, ensuring reliable operation in demanding environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring secure and long-lasting connections in the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

The FET can withstand peak reflow temperatures for a sufficient duration, allowing for proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the FET can endure the soldering process without damage, ensuring robust construction and reliability.

Technical Specifications

Power Field Effect Transistors (FET) NTLLD4951NFTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

13 A

Maximum Drain Current (ID):

13 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTLLD4951NFTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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