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NTF2955PT1G

Onsemi

NTF2955PT1G by Onsemi

NTF2955PT1G by Onsemi is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode, 1.7A max drain current, and 0.185 ohm max on resistance. This enhancement mode transistor comes in a small outline package with gull wing terminals for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,046 parts In-Stock

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5,046

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Tectiva GmbH

Germany . 2,500 parts In-Stock

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2,500

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Digiode

USA . 2,215 parts In-Stock

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2,215

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Nova Conductors

Japan . 89 parts In-Stock

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89

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Aztec Data Supply Inc.

USA . 596 parts In-Stock

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$1.250

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596

$1.250

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$1.571

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$1.492

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$1.492

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270

$1.571

$1.492

$1.492

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AZTECH Wire

Italy . 653 parts In-Stock

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$18.377

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653

$18.377

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Semicontronic

India . 1,300 parts In-Stock

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$26.050

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$25.399

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$25.268

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$26.050

$25.399

$25.268

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Ampacity Inc.

Singapore . 745 parts In-Stock

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$57.050

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745

$57.050

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Kepictronics

USA . 10,236 parts In-Stock

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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TANS Electronics

Latvia . 8,052 parts In-Stock

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Kulean Microsystems

USA . 7,103 parts In-Stock

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Continental Prestige Electronics

USA . 6,467 parts In-Stock

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Problanco Electronics

Mexico . 5,354 parts In-Stock

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Argo Parts USA

USA . 2,340 parts In-Stock

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SupplyDigital Components

Austria . 2,234 parts In-Stock

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Corphita

USA . 1,650 parts In-Stock

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1,650

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UHIMA Technologies

Türkiye . 722 parts In-Stock

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Corohmni

South Africa . 331 parts In-Stock

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331

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Unlock the power of cutting-edge technology with the NTF2955PT1G by Onsemi, a top-tier manufacturer known for superior quality and reliability. This small signal field effect transistor offers unparalleled performance in switching applications, making it a versatile solution for a wide range of electronic devices. With its P-channel configuration, built-in diode, and high DS breakdown voltage of 60V, this transistor ensures efficient operation and long-lasting durability. Experience seamless integration with its surface mount capability and compact rectangular package shape. Choose the NTF2955PT1G for enhanced efficiency and optimal performance in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

P-Channel type transistors are known for their low on-state resistance, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps protect the transistor from voltage spikes and reverse polarity, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and labor costs.

Minimum DS Breakdown Voltage: 60 V

Higher breakdown voltage provides better protection against voltage surges, improving overall reliability.

Maximum Drain Current (ID): 1.7 A

The high maximum drain current rating allows for handling of higher current loads, making it suitable for a variety of applications.

Maximum Drain-Source On Resistance: 0.185 ohm

Low on-resistance ensures efficient power handling and minimal power loss, making the transistor energy-efficient.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTF2955PT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

1.7 A

Maximum Drain-Source On Resistance:

.185 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTF2955PT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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