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NLV74HC157ADTR2G

Onsemi

NLV74HC157ADTR2G by Onsemi

NLV74HC157ADTR2G by Onsemi is a 4-function multiplexer with 32ns propagation delay at 5V. Suitable for AEC-Q100 screening, it operates b/w -55 to 125 °C and has a load capacitance of 50pF. Ideal for military-grade applications requiring CMOS technology in small outline packages.

Median Price

$0.212

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,875 parts In-Stock

1+ parts

$0.550

100+ parts

$0.329

1k+ parts

$0.196

10k+ parts

-

1,875

$0.550

$0.329

$0.196

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Rochester

USA . 58,559 parts In-Stock

1+ parts

-

100+ parts

$0.212

1k+ parts

$0.176

10k+ parts

$0.157

58,559

-

$0.212

$0.176

$0.157

Verical

USA . 55,834 parts In-Stock

1+ parts

-

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-

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-

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$0.196

55,834

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-

$0.196

Distributors (In-Stock)

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Vyrian

USA . 369 parts In-Stock

1+ parts

$0.146

100+ parts

-

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369

$0.146

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Digiode

USA . 492 parts In-Stock

1+ parts

$0.165

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-

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492

$0.165

-

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-

Distributors (Availability)

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Corohmni

South Africa . 100 parts In-Stock

1+ parts

$0.146

100+ parts

-

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100

$0.146

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Corphita

USA . 2,185 parts In-Stock

1+ parts

$0.157

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2,185

$0.157

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Vigor

Singapore . 902 parts In-Stock

1+ parts

$0.360

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902

$0.360

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Microchip USA

USA . 4,428 parts In-Stock

1+ parts

$5.330

100+ parts

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4,428

$5.330

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$12.743

100+ parts

$11.596

1k+ parts

$10.449

10k+ parts

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200

$12.743

$11.596

$10.449

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Continental Prestige Electronics

USA . 55,964 parts In-Stock

1+ parts

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100+ parts

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$0.219

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55,964

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$0.219

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Problanco Electronics

Mexico . 7,675 parts In-Stock

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7,675

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TANS Electronics

Latvia . 7,477 parts In-Stock

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7,477

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Kulean Microsystems

USA . 7,362 parts In-Stock

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7,362

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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SupplyDigital Components

Austria . 2,964 parts In-Stock

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2,964

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UHIMA Technologies

Türkiye . 244 parts In-Stock

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244

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Overview

Discover the high-quality NLV74HC157ADTR2G by Onsemi, a versatile Multiplexer & Demultiplexer designed to deliver outstanding performance in various applications. With a focus on reliability and precision, Onsemi ensures that this product offers unparalleled value and benefits to customers. Whether you're looking for efficient signal routing or data selection, this compact device with 4 functions and 3-STATE output characteristics is the perfect solution. Trust Onsemi for cutting-edge technology and superior quality in every aspect of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, which is ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 32 ns

The low propagation delay ensures fast signal processing, making this multiplexer/demultiplexer efficient for time-sensitive operations.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Functions: 4

With four functions in one device, it saves space on the PCB and simplifies the overall circuit design.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and performance standards, making this product suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard electronic systems, enhancing its versatility and ease of integration.

Load Capacitance (CL): 50 pF

The low load capacitance minimizes signal distortion and interference, ensuring accurate data transmission.

Power Supplies (V): 2/6

Support for multiple power supply voltages (2V and 6V) adds flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 16

Having 16 terminals allows for multiple connection options and configurations, making it adaptable to various circuit layouts.

Temperature Grade: MILITARY

Designed to meet military-grade temperature requirements, ensuring reliable performance in extreme environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this multiplexer/demultiplexer energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer NLV74HC157ADTR2G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

32 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74HC157ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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