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NLV14094BDG

Onsemi

NLV14094BDG by Onsemi

NLV14094BDG by Onsemi is an 8-bit digital shift register with a supply voltage of 5V. It features a propagation delay of 840ns, operates in the temperature range of -55 to 125 °C, and has a max frequency of 1.25MHz. Ideal for military-grade applications requiring high-speed data shifting in compact designs.

Median Price

$0.391

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,091 parts In-Stock

1+ parts

-

100+ parts

$0.391

1k+ parts

$0.325

10k+ parts

$0.290

6,091

-

$0.391

$0.325

$0.290

Farnell

UK . 6,091 parts In-Stock

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$0.269

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$0.269

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Verical

USA . 6,048 parts In-Stock

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$0.406

10k+ parts

$0.362

6,048

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$0.406

$0.362

Distributors (In-Stock)

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Digiode

USA . 2,381 parts In-Stock

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$0.305

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2,381

$0.305

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Vyrian

USA . 8,192 parts In-Stock

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Corohmni

South Africa . 129 parts In-Stock

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$0.269

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129

$0.269

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Corphita

USA . 538 parts In-Stock

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$0.289

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538

$0.289

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Vigor

Singapore . 930 parts In-Stock

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$0.310

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930

$0.310

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AZTECH Wire

Italy . 825 parts In-Stock

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$10.260

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$10.260

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SupplyDigital Components

Austria . 6,954 parts In-Stock

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Continental Prestige Electronics

USA . 6,091 parts In-Stock

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$0.269

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TANS Electronics

Latvia . 4,001 parts In-Stock

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Kulean Microsystems

USA . 2,540 parts In-Stock

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UHIMA Technologies

Türkiye . 585 parts In-Stock

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585

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Problanco Electronics

Mexico . 406 parts In-Stock

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406

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Microchip USA

USA . 152 parts In-Stock

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Overview

Enhance your digital shift register applications with the NLV14094BDG by Onsemi. Manufactured with top-quality materials, this product offers reliability and performance that exceeds expectations. Ideal for a wide range of uses, this 8-bit shift register provides customers with seamless integration and enhanced functionality. From its small outline package style to its positive edge trigger type, this device delivers value and benefits that cater to your specific needs. Experience the advantages of Onsemi's innovative technology and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the shift register.

Surface Mount: YES

Allows for easy and convenient mounting onto circuit boards.

Nominal Supply Voltage: 5V

Suitable for a wide range of circuits and applications.

Propagation Delay: 840 ns

Fast response time ensures efficient data processing.

Trigger Type: POSITIVE EDGE

Allows for precise and controlled triggering of data transfer.

Maximum Frequency At Nominal Supply: 1250000 Hz

Supports high-speed data transfer and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Digital Shift Registers NLV14094BDG attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

1250000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.0006 mA

Propagation Delay (tpd):

840 ns

Maximum Seated Height:

2.05 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.27 mm

Minimum fmax:

3 MHz

Trade Compliance

NLV14094BDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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