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NLV14015BDR2G

Onsemi

NLV14015BDR2G by Onsemi

NLV14015BDR2G by Onsemi is a 4-bit digital shift register with 2 functions. Operating at 5V, it has a propagation delay of 750ns and can handle temperatures from -55 to 125 °C. Ideal for military applications due to its AEC-Q100 screening level and CMOS technology.

Median Price

$0.580

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,500 parts In-Stock

1+ parts

$0.580

100+ parts

$0.316

1k+ parts

$0.274

10k+ parts

$0.247

2,500

$0.580

$0.316

$0.274

$0.247

Mouser Electronics

USA . 2,442 parts In-Stock

1+ parts

$0.580

100+ parts

$0.317

1k+ parts

$0.274

10k+ parts

$0.258

2,442

$0.580

$0.317

$0.274

$0.258

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,296 parts In-Stock

1+ parts

$0.249

100+ parts

-

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1,296

$0.249

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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Digiode

USA . 609 parts In-Stock

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609

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,389 parts In-Stock

1+ parts

$0.212

100+ parts

-

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-

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2,389

$0.212

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Corohmni

South Africa . 339 parts In-Stock

1+ parts

$0.249

100+ parts

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339

$0.249

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Vigor

Singapore . 445 parts In-Stock

1+ parts

$0.320

100+ parts

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445

$0.320

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QUARKTWIN TECHNOLOGY LTD

USA . 14,094 parts In-Stock

1+ parts

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14,094

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TANS Electronics

Latvia . 6,762 parts In-Stock

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6,762

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SupplyDigital Components

Austria . 5,730 parts In-Stock

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5,730

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Problanco Electronics

Mexico . 4,159 parts In-Stock

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4,159

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Corphita

USA . 2,399 parts In-Stock

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2,399

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Kulean Microsystems

USA . 1,349 parts In-Stock

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1,349

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UHIMA Technologies

Türkiye . 407 parts In-Stock

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407

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Overview

Enhance your digital shift register applications with the NLV14015BDR2G by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers innovative solutions that exceed industry standards. This versatile product offers customers exceptional value with its high performance and efficiency. Experience seamless integration and enhanced functionality with this advanced technology. Elevate your projects with the NLV14015BDR2G and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort.

No. of Functions: 2

Offers versatility and flexibility in terms of functionality.

Package Shape: RECTANGULAR

Efficient use of space on a circuit board without wasted area.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirements for compatibility with most electronic systems.

Propagation Delay (tpd): 750 ns

Ensures fast and efficient data processing and transfer.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for various environmental conditions.

Trigger Type: POSITIVE EDGE

Provides precise control over data transfer and synchronization.

Technology: CMOS

Low power consumption and compatibility with a wide range of electronic devices.

Technical Specifications

Digital Shift Registers NLV14015BDR2G attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

1500000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

750 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

NLV14015BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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