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NL7WB66

Onsemi

NL7WB66 by Onsemi

NL7WB66 by Onsemi is a CMOS SPST switch with 2 functions, 8 terminals, and 30 ohm max resistance. Operating b/w -55 to 125 °C, it's ideal for military-grade applications requiring fast switching (10 ns) at voltages of 1.8/5V. The small outline package with gull wing terminals makes it suitable for space-constrained designs needing separate outputs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,423 parts In-Stock

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Vyrian

USA . 1,237 parts In-Stock

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SupplyDigital Components

Austria . 7,705 parts In-Stock

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Kulean Microsystems

USA . 5,436 parts In-Stock

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Problanco Electronics

Mexico . 3,171 parts In-Stock

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Corphita

USA . 2,217 parts In-Stock

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TANS Electronics

Latvia . 624 parts In-Stock

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Corohmni

South Africa . 487 parts In-Stock

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UHIMA Technologies

Türkiye . 311 parts In-Stock

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Overview

Discover the powerful and versatile NL7WB66 by Onsemi, a high-quality multiplexer that delivers superior performance and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, this product is designed to meet the demands of various applications in the electronics industry. From data transmission to signal routing, the NL7WB66 offers unparalleled value and benefits to customers seeking precision and efficiency. Enhance your designs with this innovative solution and experience the advantages of seamless switching and optimal functionality. Elevate your projects with the NL7WB66 from Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

With surface mount capability, this product can be easily integrated onto circuit boards, saving space and simplifying the assembly process.

No. of Functions: 2

Having two functions allows for more flexibility in switching options, making this product suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to handle and mount in various systems, improving overall convenience.

Power Supplies (V): 1.8/5

With support for multiple power supply voltages, this product can operate in different conditions, enhancing its versatility.

No. of Terminals: 8

Having 8 terminals allows for multiple connection points, enabling more complex circuit configurations and functionalities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style makes it suitable for compact designs, saving space in electronic devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the product can withstand intense thermal conditions, increasing its durability and reliability.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the product to function in cold environments without any performance issues.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good conductivity and solderability, ensuring secure connections in the circuit.

Terminal Position: DUAL

Having dual terminal positions makes it easier to integrate the product into different types of circuit layouts, improving compatibility.

Output (V): SEPARATE OUTPUT

The separate output feature allows for independent voltage outputs, offering more control and customization in the switching process.

Other IC type: SPST

Being of type SPST (Single Pole, Single Throw) ensures that the product is simple to use and ideal for basic ON/OFF switching applications.

Maximum On-state Resistance (Ron): 30 ohm

The low on-state resistance of 30 ohms minimizes power loss and heat generation, improving efficiency in signal transmission.

Maximum Switch-on Time: 10 ns

The fast switch-on time of 10 nanoseconds allows for quick response in switching operations, enhancing the product's performance.

Temperature Grade: MILITARY

With military-grade temperature specifications, the product can operate in harsh environments with high reliability and stability.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical support and ease of soldering, ensuring a stable connection on the circuit board.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5mm, the product allows for compact designs and high-density integration on circuit boards.

Switching (V): MAKE-BEFORE-BREAK

The make-before-break switching mechanism ensures seamless and continuous signal flow during switching operations, preventing any interruptions.

Technical Specifications

Multiplexers & Switches NL7WB66 attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Normal Position (V):

NO

No. of Functions:

2

No. of Terminals:

8

Maximum On-state Resistance (Ron):

30 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

10 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

NL7WB66 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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