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NL7WB66G

Onsemi

NL7WB66G by Onsemi

NL7WB66G by Onsemi is a CMOS SPST switch with 2 functions, 8 terminals, and max on-state resistance of 30 ohm. It operates b/w -55 to 125 °C and has separate output at 1.8/5V power supplies. Ideal for military-grade applications requiring fast switching with make-before-break feature in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,495 parts In-Stock

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Digiode

USA . 1,070 parts In-Stock

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Problanco Electronics

Mexico . 7,102 parts In-Stock

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Kulean Microsystems

USA . 5,708 parts In-Stock

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TANS Electronics

Latvia . 1,788 parts In-Stock

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SupplyDigital Components

Austria . 1,279 parts In-Stock

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UHIMA Technologies

Türkiye . 433 parts In-Stock

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Corphita

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Corohmni

South Africa . 83 parts In-Stock

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Overview

Discover the power of seamless connectivity with the NL7WB66G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. The NL7WB66G is a versatile multiplexer and switch that offers endless possibilities for various applications. With its compact design and advanced technology, this product delivers superior performance, efficiency, and precision. Experience the value of hassle-free operation and seamless integration with the NL7WB66G - your ultimate solution for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection for the internal components of the multiplexer, ensuring long-lasting performance.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into circuit boards, saving time and effort in the assembly process.

No. of Functions: 2

Having 2 functions in one device provides versatility and efficiency in managing multiple signals or inputs in a compact form factor.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to place and secure the multiplexer in a designated location within a circuit layout.

Power Supplies (V): 1.8/5

Support for multiple power supply voltages allows for flexibility in different operating environments and voltage requirements.

No. of Terminals: 8

Having 8 terminals enables the multiplexer to connect with multiple input and output channels, expanding its functionality and use cases.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style saves valuable space on circuit boards while maintaining efficient signal routing and connectivity.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial or harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the multiplexer to function in extreme cold environments without any performance degradation.

Terminal Position: DUAL

The dual terminal position provides redundancy and ensures secure connection points for stable signal transmission.

Output (V): SEPARATE OUTPUT

Having separate output voltages enhances signal isolation and prevents crosstalk or interference between different output channels.

Other IC type: SPST

The Single-Pole, Single-Throw (SPST) configuration simplifies signal routing and selection, making it ideal for basic switching applications.

Maximum On-state Resistance (Ron): 30 ohm

The low on-state resistance minimizes signal loss and ensures efficient transmission with minimal power dissipation.

Maximum Switch-on Time: 10 ns

The fast switch-on time reduces latency and improves signal response, crucial for time-sensitive applications or high-speed data transmission.

Temperature Grade: MILITARY

The military-grade temperature rating indicates high reliability, durability, and performance under extreme temperature variations and harsh operating conditions.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the multiplexer energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and assembly processes, ensuring secure connections and reliable performance in diverse applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for precise connections and enables high-density mounting of the multiplexer in space-constrained designs.

Switching (V): MAKE-BEFORE-BREAK

The make-before-break switching feature ensures seamless and uninterrupted signal transmission during switching operations, preventing signal loss or interruptions.

Technical Specifications

Multiplexers & Switches NL7WB66G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Normal Position (V):

NO

No. of Functions:

2

No. of Terminals:

8

Maximum On-state Resistance (Ron):

30 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

10 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

NL7WB66G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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