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NIV6160MT1TWG

Onsemi

NIV6160MT1TWG by Onsemi

NIV6160MT1TWG by Onsemi is a Power Management IC with AEC-Q100 screening for automotive applications. It features a nominal voltage of 14V, small outline package style, and an adjustable threshold. With a wide operating temperature range (-40 to 125 °C) and surface mount capability, it is ideal for power supply support circuits in automotive systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,953 parts In-Stock

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Vyrian

USA . 1,731 parts In-Stock

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Problanco Electronics

Mexico . 3,278 parts In-Stock

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TANS Electronics

Latvia . 2,355 parts In-Stock

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Kulean Microsystems

USA . 1,824 parts In-Stock

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Corphita

USA . 1,589 parts In-Stock

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SupplyDigital Components

Austria . 523 parts In-Stock

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Corohmni

South Africa . 167 parts In-Stock

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UHIMA Technologies

Türkiye . 50 parts In-Stock

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Overview

Enhance your power management solutions with the NIV6160MT1TWG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that are AEC-Q100 screened, ensuring reliability and durability. This small outline, heat sink package offers a very thin profile, making it ideal for automotive applications. With adjustable threshold capabilities and a wide operating temperature range, this product provides exceptional value and performance for customers looking to optimize their power systems. Experience the advantages of Onsemi's innovative technology with the NIV6160MT1TWG.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily and securely mounted on the surface of a circuit board, reducing the need for additional hardware and simplifying the assembly process.

Screening Level: AEC-Q100

AEC-Q100 certification ensures that this product meets the robustness and quality standards required for automotive applications, providing reliability and performance in harsh environments.

Nominal Supply Voltage (Vsup): 14 V

The 14 V supply voltage capability allows this product to be compatible with a wide range of automotive power systems, making it versatile for various vehicle applications.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The compact and efficient package style of this product allows for space-saving installation and effective heat dissipation, enhancing overall system performance and reliability.

Maximum Operating Temperature: 125 °C

This product can withstand high operating temperatures up to 125 °C, ensuring stable and reliable operation even in demanding automotive environments.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization and fine-tuning of the product's performance, enabling precise control and optimization based on specific application requirements.

Technical Specifications

Power Management ICs NIV6160MT1TWG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XDSO-N12

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC12,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

NIV6160MT1TWG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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