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NIV6150MT1TXG

Onsemi

NIV6150MT1TXG by Onsemi

NIV6150MT1TXG by Onsemi is a Power Management IC with AEC-Q100 screening, 5V supply voltage, and -40 to 125 °C operating temperature range. It features a small outline package style suitable for automotive applications. This IC has 10 terminals, surface mount capability, and adjustable threshold for power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,069 parts In-Stock

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Digiode

USA . 511 parts In-Stock

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Microchip USA

USA . 5,777 parts In-Stock

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$4.156

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AZTECH Wire

Italy . 904 parts In-Stock

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Kulean Microsystems

USA . 7,676 parts In-Stock

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Problanco Electronics

Mexico . 6,559 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 3,148 parts In-Stock

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Corphita

USA . 2,096 parts In-Stock

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TANS Electronics

Latvia . 1,088 parts In-Stock

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Corohmni

South Africa . 305 parts In-Stock

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UHIMA Technologies

Türkiye . 295 parts In-Stock

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Overview

Discover the power and reliability of the NIV6150MT1TXG by Onsemi, a leading manufacturer in the industry of Power Management ICs. This versatile product offers a wide range of applications, ensuring seamless integration into various projects. With its high-quality construction and AEC-Q100 screening level, you can trust in its performance under extreme conditions. Experience the value and benefits of this innovative solution, providing customers with unmatched efficiency and peace of mind. Choose Onsemi for your power management needs and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for automotive applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and quality standards, making it suitable for automotive use.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V makes it compatible with a wide range of systems.

No. of Terminals: 10

Having 10 terminals provides flexibility in connecting to various components within the circuit.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style allows for space-saving and efficient heat dissipation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand extreme conditions.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40 °C ensures functionality in cold environments.

Adjustable Threshold: YES

The ability to adjust the threshold provides customization options based on specific requirements.

Technical Specifications

Power Management ICs NIV6150MT1TXG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

Electronic Fuse

Adjustable Threshold:

YES

JESD-30 Code:

S-XDSO-N10

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Width (mm):

3 mm

Trade Compliance

NIV6150MT1TXG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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