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NILMS4501NR2G

Onsemi

NILMS4501NR2G by Onsemi

NILMS4501NR2G by Onsemi is a N-CHANNEL FET with 24V DS Breakdown Voltage, 14A IDM, and 0.016 ohm RDS. Ideal for SWITCHING applications in ENHANCEMENT MODE, it has a 175 °C Max Operating Temp and 50mJ EAS rating.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

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Digiode

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Bristol Electronics

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AZTECH Wire

Italy . 1,089 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

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TANS Electronics

Latvia . 3,423 parts In-Stock

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Problanco Electronics

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Kepictronics

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Corphita

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SupplyDigital Components

Austria . 537 parts In-Stock

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UHIMA Technologies

Türkiye . 407 parts In-Stock

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Corohmni

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Overview

Experience the power of innovation with the NILMS4501NR2G by Onsemi. As a leading manufacturer in the field of Power Field Effect Transistors (FET), Onsemi delivers top-notch quality and reliability. This N-CHANNEL transistor, configured as a current mirror with a built-in diode, is ideal for switching applications. With a minimum DS breakdown voltage of 24V and a maximum pulsing drain current of 14A, this transistor offers exceptional performance. Its surface mount design and compact package shape make it easy to integrate into various electronic devices. Trust Onsemi to provide cutting-edge technology that enhances efficiency and functionality. Elevate your projects with the NILMS4501NR2G and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good insulation and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and low on-resistance, making them suitable for various switching applications.

Configuration: CURRENT MIRROR WITH BUILT-IN DIODE

The current mirror configuration with a built-in diode allows for accurate current replication and control, making the FET ideal for precision circuit applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast turn-on and turn-off times, maximizing efficiency in power management.

Surface Mount: YES

The surface-mount capability of this FET simplifies PCB assembly and saves space, making it ideal for compact electronic devices.

Minimum DS Breakdown Voltage: 24 V

With a minimum breakdown voltage of 24 V, this FET can handle high voltages safely, making it reliable for industrial and automotive applications.

Maximum Pulsed Drain Current (IDM): 14 A

The high pulsed drain current rating of 14 A allows this FET to handle short-duration peak loads, making it suitable for power supply and motor control applications.

Avalanche Energy Rating (EAS): 50 mJ

The high avalanche energy rating of 50 mJ ensures that this FET can withstand transient voltage spikes without damage, improving overall system reliability.

Maximum Power Dissipation (Abs): 2.7 W

The maximum power dissipation of 2.7 W indicates the FET's ability to handle heat dissipation efficiently, ensuring reliable operation under high power conditions.

Maximum Drain-Source On Resistance: 0.016 ohm

The low on-resistance of 0.016 ohm results in minimal power loss and heat generation when the FET is conducting, making it energy-efficient for various applications.

Technical Specifications

Power Field Effect Transistors (FET) NILMS4501NR2G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

50 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

9.5 A

Maximum Drain Current (ID):

9.5 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PBCC-N4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

14 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NILMS4501NR2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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