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NFVA33065L32

Onsemi

NFVA33065L32 by Onsemi

NFVA33065L32 by Onsemi is a 27-terminal AC motor controller IC with a max output current of 60A. It operates at a nominal voltage of 300V and can handle up to 400V. This hybrid technology IC in rectangular package shape with flange mount is ideal for motion control applications.

Median Price

$32.950

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Arrow

USA . 20 parts In-Stock

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$24.575

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$20.681

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Mouser Electronics

USA . 122 parts In-Stock

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DigiKey

USA . 39 parts In-Stock

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$21.250

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Chip1Stop

Japan . 321 parts In-Stock

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$118.000

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$55.300

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Digiode

USA . 1,174 parts In-Stock

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Vyrian

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Corphita

USA . 1,614 parts In-Stock

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$22.118

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Corohmni

South Africa . 253 parts In-Stock

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Microchip USA

USA . 7,297 parts In-Stock

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$79.994

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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TANS Electronics

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Kulean Microsystems

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Problanco Electronics

Mexico . 4,666 parts In-Stock

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SupplyDigital Components

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UHIMA Technologies

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Overview

Experience unparalleled precision and efficiency with the NFVA33065L32 Motion Control IC by Onsemi. As a leader in the industry, Onsemi delivers top-quality products that guarantee seamless operation and optimal performance. Ideal for AC motor control applications, this IC offers advanced technology and a maximum output current of 60A, providing customers with unmatched value and benefits. Say goodbye to inefficiency and hello to superior control with the NFVA33065L32 - the ultimate solution for your motion control needs.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient and compact PCB design, saving valuable board space.

Nominal Supply Voltage (Vsup): 300 V

Suitable for high voltage applications, providing the necessary power for driving motors effectively.

No. of Terminals: 27

Sufficient number of terminals for connecting to various components and peripherals in a motion control system.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers easy and secure mounting options for integration into machinery or equipment.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good conductivity and solderability, ensuring reliable connections for stable operation.

Terminal Position: DUAL

Dual terminal position allows for flexibility in board layout and routing of connections, facilitating customization.

Other IC type: AC MOTOR CONTROLLER

Specifically designed for controlling AC motors, offering specialized features and functions for motor control applications.

Maximum Output Current: 60 A

High maximum output current capability enables driving of powerful motors, suitable for heavy-duty industrial applications.

Technology: HYBRID

Hybrid technology combines the advantages of different technologies, providing a balance of performance and efficiency in motor control.

Terminal Form: THROUGH-HOLE

Through-hole terminal form facilitates easy assembly onto PCBs, ensuring secure and reliable connections for long-term use.

Maximum Supply Voltage (Vsup): 400 V

Ability to handle high supply voltages up to 400 V, ideal for demanding applications requiring high power and voltage levels.

Technical Specifications

Motion Control ICs NFVA33065L32 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

CONTROL SUPPLY VOLTAGE(VCC)= 15V

Other IC type:

JESD-30 Code:

R-XDFM-T27

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

27

Maximum Output Current:

60 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Maximum Supply Voltage (Vsup):

400 V

Nominal Supply Voltage (Vsup):

300 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

NFVA33065L32 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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