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NFL25065L4BT

Onsemi

NFL25065L4BT by Onsemi

NFL25065L4BT by Onsemi is a Motion Control IC with 32 terminals, operating temperature range of -40 to 125°C. It features a max output current of 100A, suitable for automotive applications. This AC motor controller has a hybrid technology and can handle up to 400V supply voltage.

Median Price

$32.295

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 37 parts In-Stock

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$42.300

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$30.180

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37

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$30.180

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DigiKey

USA . 360 parts In-Stock

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-

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$22.290

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360

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Flip Electronics (Authorized)

USA . 360 parts In-Stock

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360

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Distributors (In-Stock)

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Digiode

USA . 397 parts In-Stock

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$26.581

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397

$26.581

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Chip Stock

USA . 60,000 parts In-Stock

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Vyrian

USA . 6,279 parts In-Stock

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Flip Electronics

USA . 360 parts In-Stock

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360

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Distributors (Availability)

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Corphita

USA . 2,351 parts In-Stock

1+ parts

$25.182

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2,351

$25.182

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Corohmni

South Africa . 440 parts In-Stock

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$27.950

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440

$27.950

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Microchip USA

USA . 8,453 parts In-Stock

1+ parts

$86.670

100+ parts

$85.160

1k+ parts

$84.410

10k+ parts

$83.660

8,453

$86.670

$85.160

$84.410

$83.660

Problanco Electronics

Mexico . 7,156 parts In-Stock

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TANS Electronics

Latvia . 6,192 parts In-Stock

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Kulean Microsystems

USA . 5,143 parts In-Stock

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SupplyDigital Components

Austria . 2,487 parts In-Stock

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UHIMA Technologies

Türkiye . 290 parts In-Stock

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290

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Perfect Parts

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Overview

Elevate your motion control applications with the NFL25065L4BT from Onsemi. Designed to deliver top-notch performance and reliability, this AC motor controller offers seamless operation in automotive environments. With a maximum output current of 100A and a technology grade of HYBRID, this innovative product ensures optimal efficiency and precision. Trust in Onsemi's expertise in manufacturing high-quality motion control ICs to take your projects to the next level. Unlock new possibilities and elevate your designs with the NFL25065L4BT.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for efficient and compact design, making it suitable for applications where space is limited.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options, allowing for versatile integration into different systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures product can operate in extreme cold conditions as well.

Maximum Output Current: 100 A

High maximum output current capability makes this product suitable for driving powerful motors and handling high loads.

Technology: HYBRID

Hybrid technology offers a good balance between performance and efficiency, making it a reliable choice for motion control applications.

Maximum Supply Voltage (Vsup): 400 V

High maximum supply voltage allows for compatibility with a wide range of power sources, increasing flexibility in system design.

Technical Specifications

Motion Control ICs NFL25065L4BT attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO HAS INPUT SUPPLY VOLTAGE FROM 187VRMS TO 253 VRMS

Other IC type:

JESD-30 Code:

R-XDMA-T32

JESD-609 Code:

e3

Length:

60 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

100 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

8.7 mm

Maximum Supply Voltage (Vsup):

400 V

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

31 mm

Trade Compliance

NFL25065L4BT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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