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NDPL100N10BG

Onsemi

NDPL100N10BG by Onsemi

The Onsemi NDPL100N10BG is a Power FET with 100V DS Breakdown Voltage, 400A IDM, and 0.0087 ohm RDS(ON). Ideal for SWITCHING applications, it features N-CHANNEL polarity in a RECTANGULAR package with THROUGH-HOLE terminals. Operating in ENHANCEMENT MODE, this FET has an EAS of 147mJ and can handle up to 100A ID.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,899 parts In-Stock

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Digiode

USA . 985 parts In-Stock

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AZTECH Wire

Italy . 1,063 parts In-Stock

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Problanco Electronics

Mexico . 7,074 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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TANS Electronics

Latvia . 3,893 parts In-Stock

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SupplyDigital Components

Austria . 1,015 parts In-Stock

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UHIMA Technologies

Türkiye . 961 parts In-Stock

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Corphita

USA . 953 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 75 parts In-Stock

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Perfect Parts

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Kulean Microsystems

USA . 37 parts In-Stock

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Overview

Onsemi's NDPL100N10BG is a game-changer in the realm of Power Field Effect Transistors. With its robust construction and cutting-edge technology, this N-CHANNEL transistor is designed for high-performance applications like switching with ease. Onsemi's reputation for quality and reliability shines through in this product, offering customers unmatched value and benefits. Say goodbye to compromises and hello to superior performance with the NDPL100N10BG by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, ensuring a longer lifespan for the power FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher current carrying capabilities, making this power FET suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for simplified circuit design and protection against reverse polarity, adding to the reliability of the overall system.

Transistor Application: SWITCHING

Designed for switching applications, this power FET can efficiently control the flow of current in electronic circuits, making it ideal for power management tasks.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100 V, this power FET can handle high voltage levels without the risk of damage, ensuring reliable performance in demanding environments.

Maximum Pulsed Drain Current (IDM): 400 A

The high maximum pulsed drain current rating of 400 A allows this power FET to handle sudden peaks in current demand without overheating or failing, making it suitable for heavy-duty applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this power FET can operate efficiently in high-temperature environments, providing reliable performance in demanding conditions.

Technical Specifications

Power Field Effect Transistors (FET) NDPL100N10BG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

147 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0087 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDPL100N10BG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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