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NCV8501PDWADJR2G

Onsemi

NCV8501PDWADJR2G by Onsemi

Onsemi's NCV8501PDWADJR2G is an AEC-Q100 compliant LDO regulator with adjustable output voltage range from 1.242V to 1.318V, ideal for automotive applications. It offers a max dropout voltage of 0.6V and can handle a max output current of 0.15A, making it suitable for various power management needs in automotive electronics.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,925 parts In-Stock

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Digiode

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Vigor

Singapore . 366 parts In-Stock

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$1.110

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366

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AZTECH Wire

Italy . 1,059 parts In-Stock

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$15.630

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SupplyDigital Components

Austria . 5,941 parts In-Stock

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Kulean Microsystems

USA . 2,645 parts In-Stock

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Problanco Electronics

Mexico . 1,878 parts In-Stock

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Corphita

USA . 894 parts In-Stock

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TANS Electronics

Latvia . 886 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 238 parts In-Stock

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Corohmni

South Africa . 149 parts In-Stock

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Microchip USA

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Overview

Discover the NCV8501PDWADJR2G by Onsemi, a top-of-the-line Adjustable Regulator that delivers exceptional performance and reliability. With Onsemi's reputation for superior quality and cutting-edge technology, this LDO regulator is perfect for a wide range of applications. From automotive to industrial electronics, this product offers customers unmatched value, efficiency, and precision. Don't settle for anything less than the best - choose the NCV8501PDWADJR2G for all your power regulation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, perfect for various applications.

Maximum Dropout Voltage: 1.6 V

The low maximum dropout voltage ensures efficient power conversion with minimal loss, making it ideal for power-sensitive applications.

Surface Mount: YES

The surface mount feature makes the product easy to install and reduces assembly time, making it convenient for production processes.

Operating Temperature (TJ-Max): 150 °C

The high maximum operating temperature allows the regulator to withstand extreme temperatures, increasing its reliability in harsh environments.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures the product meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

Technology: BIPOLAR

The bipolar technology used in the regulator provides accurate and stable voltage regulation, ensuring consistent performance over time.

Package Shape: RECTANGULAR

The rectangular package shape allows for compact and efficient placement on PCBs, saving space and facilitating easier design and layout.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, reducing the risk of electrical failures and ensuring long-term performance.

Operating Temperature (TJ-Min): -40 °C

The low minimum operating temperature allows the regulator to operate in cold environments, making it versatile and suitable for a wide range of applications.

Packing Method: TR

The TR packing method ensures safe and efficient packaging for transportation and storage, reducing the risk of damage during handling.

Minimum Output Voltage: 1.242 V

The low minimum output voltage allows for precise voltage regulation, making the regulator suitable for applications requiring stable and accurate voltage output.

No. of Terminals: 16

The 16 terminals provide versatile connectivity options, accommodating various PCB layouts and configurations for flexible integration.

Maximum Line Regulation: 0.2%

The low maximum line regulation ensures consistent performance under varying input voltages, providing stable and reliable voltage output for different operating conditions.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style with a heat sink/slug design optimizes heat dissipation, improving thermal performance and ensuring the regulator operates efficiently and reliably.

Adjustability: ADJUSTABLE

The adjustable feature allows users to customize the output voltage according to specific requirements, increasing the product's flexibility and suitability for different applications.

Maximum Load Regulation: 2.4%

The low maximum load regulation ensures stable voltage output under varying load conditions, making the regulator suitable for applications with dynamic power demands.

Terminal Pitch: 1.27 mm

The small terminal pitch enables compact design and easy integration into densely populated PCBs, making it suitable for space-constrained applications.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

The adjustable positive single output LDO regulator provides precise voltage regulation with low noise and high efficiency, making it ideal for sensitive electronic devices and applications.

Terminal Finish: Tin (Sn)

The tin terminal finish provides corrosion resistance and reliable connections, ensuring long-term durability and performance.

Terminal Position: DUAL

The dual terminal position allows for multiple wiring configurations, providing flexibility in installation and enhancing compatibility with different PCB layouts.

Maximum Output Voltage: 1.318 V

The high maximum output voltage capability ensures compatibility with a wide range of applications that require specific voltage levels for optimal performance.

Maximum Seated Height: 2.65 mm

The low maximum seated height allows for a compact and slim profile, making it suitable for space-limited applications where height constraints are a concern.

Width: 7.5 mm

The narrow width of the regulator facilitates easy placement on PCBs and saves space, enabling more efficient and compact system designs.

Maximum Output Current: 0.15 A

The maximum output current rating allows the regulator to provide stable power delivery for low to medium power applications, making it versatile for various electronic devices and systems.

Maximum Time At Peak Reflow Temperature: 40s

The 40-second maximum time at peak reflow temperature ensures proper soldering and component assembly, reducing the risk of damage during manufacturing processes.

Peak Reflow Temperature: 260C

The high peak reflow temperature capability allows for reliable and secure solder joints during assembly, ensuring long-lasting performance and durability.

Nominal Dropout Voltage: 0.4 V

The low nominal dropout voltage minimizes power loss and ensures efficient voltage regulation, making the regulator energy-efficient and suitable for battery-operated devices.

Length: 10.3 mm

The compact length of the regulator allows for space-efficient placement on PCBs, enabling streamlined design and layout for improved system integration.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO NCV8501PDWADJR2G attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.4 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Maximum Line Regulation (%/V):

.2

Maximum Load Regulation (%):

2.4 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

16

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

1.318 V

Minimum Output Voltage-1:

1.242 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP16,.4

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

NCV8501PDWADJR2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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