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NCV8164CAMLADJTCG

Onsemi

NCV8164CAMLADJTCG by Onsemi

NCV8164CAMLADJTCG by Onsemi is an adjustable positive single output LDO regulator with a max output current of 0.3A and a max input-output voltage differential of 3.776V. It operates in a wide temperature range from -40 to 150 °C, making it suitable for automotive applications requiring precise voltage regulation in compact spaces.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 1,251 parts In-Stock

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Vyrian

USA . 873 parts In-Stock

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Problanco Electronics

Mexico . 6,606 parts In-Stock

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SupplyDigital Components

Austria . 5,507 parts In-Stock

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Kulean Microsystems

USA . 2,985 parts In-Stock

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TANS Electronics

Latvia . 1,158 parts In-Stock

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Corphita

USA . 598 parts In-Stock

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UHIMA Technologies

Türkiye . 308 parts In-Stock

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Corohmni

South Africa . 308 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Onsemi with the NCV8164CAMLADJTCG adjustable regulator. This versatile component is perfect for a wide range of applications, offering precise control and stable performance. With advanced features and a compact design, this LDO regulator delivers exceptional value to customers looking for superior power management solutions. Trust Onsemi to provide cutting-edge technology that meets your needs with excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on a PCB, saving space and reducing assembly time.

Operating Temperature (TJ-Max): 150 °C

With a high maximum operating temperature, this regulator can withstand extreme conditions and maintain stable performance.

Maximum Input-Output Voltage Differential: 3.776 V

The high maximum voltage differential ensures reliable operation and efficient regulation between input and output voltages.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures the product meets rigorous automotive industry requirements for quality and reliability.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy placement on a PCB, optimizing board layout.

Operating Temperature (TJ-Min): -40 °C

The low minimum operating temperature allows for reliable performance even in cold environments, making it suitable for a wide range of applications.

Packing Method: TR

The TR packing method ensures safe transportation and storage of the product, reducing the risk of damage during handling.

Minimum Output Voltage-1: 0.5 V

The minimum output voltage of 0.5V allows for precise voltage regulation and adjustment, catering to a variety of power supply requirements.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for a more versatile integration into different circuit designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enables efficient heat dissipation and space-saving on the PCB.

Adjustability: ADJUSTABLE

The adjustable feature allows for fine-tuning of the output voltage, making it suitable for a wide range of applications with varying voltage requirements.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting on the PCB, optimizing space and facilitating compact designs.

Minimum Input-Output Voltage Differential: 0.424 V

The low minimum input-output voltage differential ensures efficient voltage regulation and minimal power loss, enhancing overall system performance.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

Being an adjustable positive single output LDO regulator ensures stable output voltage with low dropout and noise, making it ideal for sensitive electronic devices.

Terminal Position: DUAL

The dual terminal position allows for easy and secure connection, providing additional stability and reliability in the circuit.

Maximum Output Voltage-1: 3.8 V

The high maximum output voltage of 3.8V meets various voltage requirements and provides ample headroom for powering different components in the circuit.

Maximum Seated Height: 1 mm

With a low maximum seated height of 1mm, the product can be integrated into compact and slim devices without compromising space constraints.

Width: 3 mm

The compact width of 3mm allows for easy integration into tight spaces on the PCB, enabling efficient board layout and space optimization.

Maximum Output Current-1: 0.3 A

With a maximum output current of 0.3A, the regulator can efficiently power a variety of components while maintaining stable voltage output.

Length: 3 mm

The small length of 3mm enhances the product's compactness and ease of integration into space-constrained applications.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO NCV8164CAMLADJTCG attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Input-Output Voltage Differential:

3.776 V

Minimum Input-Output Voltage Differential:

.424 V

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.3 A

Maximum Output Voltage-1:

3.8 V

Minimum Output Voltage-1:

.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

NCV8164CAMLADJTCG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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