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NCV78763MW1R2G

Onsemi

NCV78763MW1R2G by Onsemi

NCV78763MW1R2G by Onsemi is a Graphics Display Driver with 32 terminals, operating voltage range of 3.15V to 3.4V, and max supply current of 15mA. It is designed for automotive applications, featuring AEC-Q100 screening level and a temperature grade suitable for harsh environments up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,912 parts In-Stock

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Digiode

USA . 2,287 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 978 parts In-Stock

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$9.860

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978

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Component Stockers USA

USA . 687 parts In-Stock

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$99.990

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687

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Problanco Electronics

Mexico . 7,717 parts In-Stock

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TANS Electronics

Latvia . 6,171 parts In-Stock

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Kulean Microsystems

USA . 5,263 parts In-Stock

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SupplyDigital Components

Austria . 2,937 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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UHIMA Technologies

Türkiye . 410 parts In-Stock

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Corohmni

South Africa . 369 parts In-Stock

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369

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Microchip USA

USA . 363 parts In-Stock

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Corphita

USA . 356 parts In-Stock

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Overview

Enhance your automotive display experience with the NCV78763MW1R2G by Onsemi. As a leading manufacturer in the industry, Onsemi's Graphics Display Drivers boast superior quality and reliability. Designed for automotive applications, this LED display driver offers seamless integration, high performance, and efficiency. Elevate your driving experience with crisp and vibrant visuals, all while enjoying the peace of mind that comes with Onsemi's trusted brand. Upgrade your display systems today with the NCV78763MW1R2G. Drive smarter, drive better.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making it a good choice for graphics display drivers.

Maximum Supply Voltage: 3.4 V

Suitable for a wide range of applications while providing efficient power consumption.

Package Shape: SQUARE

Square packages are space-efficient and allow for easier PCB layout, making the product easy to integrate into a design.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it suitable for automotive and outdoor applications.

Maximum Seated Height: 0.9 mm

Low profile design saves space and allows for sleek and compact product designs.

Minimum fmax: 8.9 MHz

High frequency capability allows for rapid refresh rates and smooth display performance.

Technical Specifications

Graphics Display Drivers NCV78763MW1R2G attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

No. of Terminals:

32

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5/40

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Sub-Category:

Display Drivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

3.4 V

Minimum Supply Voltage:

3.15 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Minimum fmax:

8.9 MHz

Trade Compliance

NCV78763MW1R2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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