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NCV78713MW0R2G

Onsemi

NCV78713MW0R2G by Onsemi

NCV78713MW0R2G by Onsemi is a Graphics Display Driver with 24 terminals, operating at -40 to 150 °C. It has a supply voltage range of 3.05V to 3.6V and low supply current of 6mA, making it ideal for automotive LED display driver applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,365 parts In-Stock

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8,365

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Digiode

USA . 2,182 parts In-Stock

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2,182

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 634 parts In-Stock

1+ parts

$9.930

100+ parts

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634

$9.930

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SupplyDigital Components

Austria . 7,962 parts In-Stock

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7,962

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Kulean Microsystems

USA . 7,319 parts In-Stock

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7,319

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TANS Electronics

Latvia . 2,469 parts In-Stock

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2,469

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Problanco Electronics

Mexico . 2,326 parts In-Stock

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2,326

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UHIMA Technologies

Türkiye . 666 parts In-Stock

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666

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Microchip USA

USA . 470 parts In-Stock

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470

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Corohmni

South Africa . 420 parts In-Stock

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420

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Corphita

USA . 362 parts In-Stock

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362

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Overview

Experience the cutting-edge technology of the NCV78713MW0R2G by Onsemi, a top-tier manufacturer known for high-quality products. This LED display driver offers unrivaled performance and reliability, making it ideal for a wide range of automotive applications. With a sleek square package design and advanced features, this product ensures seamless integration and efficient operation. Elevate your projects with the NCV78713MW0R2G and enjoy superior results that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the driver, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of input power sources, making the driver versatile and adaptable.

Package Shape: SQUARE

The square shape of the package enhances the ease of mounting and integration into different systems, providing flexibility in design.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the driver can withstand harsh environmental conditions and maintain stable performance in demanding applications.

Width: 5 mm

The compact width of the driver allows for space-saving installation, making it ideal for applications where size constraints are a concern.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that the driver is designed to meet the stringent requirements of automotive applications, ensuring reliability and durability in challenging environments.

Interface IC Type: LED DISPLAY DRIVER

The LED display driver interface allows for seamless control and management of LED displays, making the driver suitable for various display applications.

Technical Specifications

Graphics Display Drivers NCV78713MW0R2G attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.2SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Current:

6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.05 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NCV78713MW0R2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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