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NCV59301DS50R4G

Onsemi

NCV59301DS50R4G by Onsemi

Onsemi's NCV59301DS50R4G is a 5V fixed positive single output LDO regulator with 3A max output current. It has a max dropout voltage of 0.5V and operates in temperatures ranging from -40 to 125 °C. Ideal for automotive applications due to AEC-Q100 screening level and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,963 parts In-Stock

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Digiode

USA . 1,019 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 405 parts In-Stock

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$2.070

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405

$2.070

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$2.119

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$1.928

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$1.738

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Ampacity Inc.

Singapore . 987 parts In-Stock

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$9.500

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AZTECH Wire

Italy . 341 parts In-Stock

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$18.510

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Kulean Microsystems

USA . 6,625 parts In-Stock

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TANS Electronics

Latvia . 3,585 parts In-Stock

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Problanco Electronics

Mexico . 3,360 parts In-Stock

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SupplyDigital Components

Austria . 895 parts In-Stock

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UHIMA Technologies

Türkiye . 851 parts In-Stock

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Corphita

USA . 322 parts In-Stock

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Corohmni

South Africa . 294 parts In-Stock

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Microchip USA

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Overview

Experience the unmatched quality and reliability of Onsemi with the NCV59301DS50R4G Fixed Regulator. This innovative product offers a range of applications in various industries, providing stable output voltage and efficient performance. With its advanced technology and AEC-Q100 screening level, customers can trust in the value and benefits it brings to their projects. Say goodbye to voltage fluctuations and hello to seamless operation with the NCV59301DS50R4G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, which is ideal for portable or rugged applications.

Maximum Dropout Voltage: 1.5 V

With a low maximum dropout voltage of 1.5 V, this LDO regulator can maintain a stable output voltage even when the input voltage is close to the output voltage, ensuring reliable performance.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and space in the manufacturing process.

Operating Temperature (TJ-Max): 125 °C

The high maximum operating temperature of 125 °C ensures the regulator can withstand elevated temperatures, making it suitable for a wide range of applications.

Screening Level: AEC-Q100

AEC-Q100 screening level indicates that the product has undergone rigorous testing for automotive applications, ensuring high reliability and performance in demanding environments.

Technology: BIPOLAR

The bipolar technology used in this regulator provides excellent line and load regulation, as well as low output noise, making it suitable for sensitive electronic devices.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV59301DS50R4G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.5 V

Nominal Dropout Voltage-1:

.3 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

13.5 V

Minimum Input Voltage:

2.24 V

JESD-30 Code:

R-PSSO-G5

JESD-609 Code:

e3

Length:

10.02 mm

Maximum Line Regulation:

.025 %

Maximum Load Regulation:

.05 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

5.125 V

Minimum Output Voltage-1:

4.875 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

4.826 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.702 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

9.1945 mm

Trade Compliance

NCV59301DS50R4G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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