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NCV551SN28T1G

Onsemi

NCV551SN28T1G by Onsemi

NCV551SN28T1G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 2.8V and max output current of 0.15A. It operates at temperatures ranging from -40 to 125 °C, making it suitable for automotive applications requiring stable voltage regulation in compact spaces. With a small outline package style and surface mount capability, this CMOS technology-based regulator offers precise voltage control with minimal dropout voltage for efficient power management in automotive electronics.

Median Price

$0.244

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 27,000 parts In-Stock

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Rochester

USA . 235 parts In-Stock

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$0.244

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$0.203

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$0.181

235

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$0.203

$0.181

Distributors (In-Stock)

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Digiode

USA . 1,562 parts In-Stock

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$0.190

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USA . 18,000 parts In-Stock

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Chip Stock

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Vyrian

USA . 3,866 parts In-Stock

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Bristol Electronics

USA . 2,051 parts In-Stock

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Corphita

USA . 207 parts In-Stock

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$0.180

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Corohmni

South Africa . 243 parts In-Stock

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$0.200

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Vigor

Singapore . 509 parts In-Stock

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$0.230

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509

$0.230

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AZTECH Wire

Italy . 295 parts In-Stock

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$11.670

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Perfect Parts

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Microchip USA

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Problanco Electronics

Mexico . 2,492 parts In-Stock

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SupplyDigital Components

Austria . 1,813 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 763 parts In-Stock

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Continental Prestige Electronics

USA . 184 parts In-Stock

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TANS Electronics

Latvia . 170 parts In-Stock

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Overview

Discover the NCV551SN28T1G by Onsemi, a top-tier manufacturer known for producing high-quality fixed regulators. This LDO regulator offers reliable performance and precise output voltage control, making it perfect for a wide range of applications. From consumer electronics to automotive systems, this compact and efficient device ensures stable power delivery with minimal dropout voltage. Trust Onsemi to deliver cutting-edge technology in a small package, providing exceptional value and benefits to customers looking for superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the regulator, making it reliable for long-term use.

Maximum Dropout Voltage: 1.15 V

The low dropout voltage of 1.15 V ensures efficient regulation and minimal power loss, making it suitable for applications where energy efficiency is crucial.

Surface Mount: YES

The surface mount capability of the regulator makes it easy to integrate into PCB designs, saving space and simplifying assembly processes.

Operating Temperature (TJ-Max): 150 °C

With an operating temperature of up to 150 °C, this regulator is suitable for industrial and automotive applications that require high temperature tolerance.

Technology: CMOS

The CMOS technology used in this regulator ensures low power consumption and high efficiency, making it ideal for battery-powered devices or applications where heat dissipation is a concern.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV551SN28T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.15 V

Nominal Dropout Voltage-1:

.04 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

12 V

Minimum Input Voltage:

3.8 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Maximum Line Regulation:

.03 %

Maximum Load Regulation:

.065 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

2.884 V

Minimum Output Voltage-1:

2.716 V

Nominal Output Voltage-1:

2.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

1.5 mm

Trade Compliance

NCV551SN28T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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