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NCV5501DT33G

Onsemi

NCV5501DT33G by Onsemi

NCV5501DT33G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.5A. It operates in temperatures ranging from -40 to 125°C, making it suitable for automotive applications requiring stable voltage regulation in harsh environments. With AEC-Q100 screening level, this bipolar technology regulator offers precise voltage control with low dropout voltage for reliable performance.

Median Price

$1.310

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 750 parts In-Stock

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$1.310

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750

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Flip Electronics (Authorized)

USA . 750 parts In-Stock

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750

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Nova Conductors

Japan . 200 parts In-Stock

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$0.734

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Vyrian

USA . 3,844 parts In-Stock

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Digiode

USA . 1,050 parts In-Stock

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Flip Electronics

USA . 750 parts In-Stock

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Chip Stock

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Bas Electronics GmbH & Co. KG

Germany . 15 parts In-Stock

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Corohmni

South Africa . 142 parts In-Stock

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$0.704

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Aranea Global

USA . 2,000 parts In-Stock

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$0.719

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$0.690

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$0.719

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Vigor

Singapore . 616 parts In-Stock

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$0.960

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Ampacity Inc.

Singapore . 315 parts In-Stock

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$2.420

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Microchip USA

USA . 5,083 parts In-Stock

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Kulean Microsystems

USA . 3,870 parts In-Stock

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SupplyDigital Components

Austria . 2,784 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 960 parts In-Stock

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Problanco Electronics

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TANS Electronics

Latvia . 347 parts In-Stock

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Overview

Looking for reliable and efficient power management solutions? Look no further than the NCV5501DT33G by Onsemi. With a reputation for high-quality products, Onsemi's fixed regulator offers a seamless solution for your voltage regulation needs. Perfect for a variety of applications, this LDO regulator ensures stable output voltage with minimal dropout. Experience the value and benefits that Onsemi's NCV5501DT33G brings to your projects, providing peace of mind and efficiency in your designs. Trust Onsemi for superior performance and reliability in power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the regulator, ensuring reliable performance and longevity.

Maximum Dropout Voltage-1: 1.7 V

With a low dropout voltage, this regulator can maintain a stable output voltage even when the input voltage is close to the output voltage, making it suitable for low-power applications.

Operating Temperature (TJ-Max): 150 °C

The wide operating temperature range of up to 150°C ensures that the regulator can perform consistently in extreme temperature conditions, making it versatile for various environments.

Technology: BIPOLAR

Bipolar technology allows for precise voltage regulation with low noise and high stability, making this regulator ideal for sensitive electronics and applications that require accurate voltage output.

Nominal Output Voltage-1: 3.3 V

The fixed output voltage of 3.3 V ensures a consistent and reliable power supply for compatible devices, eliminating the need for external voltage regulation components.

Maximum Output Current-1: 0.5 A

With a high output current capability of 0.5 A, this regulator can power a wide range of devices and circuits, making it suitable for various applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV5501DT33G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.7 V

Nominal Dropout Voltage-1:

.23 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

16 V

Minimum Input Voltage:

4 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.54 mm

Maximum Line Regulation:

.033 %

Maximum Load Regulation:

.033 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

150 Cel

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

3.462 V

Minimum Output Voltage-1:

3.138 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.38,90TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.38 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

6.095 mm

Trade Compliance

NCV5501DT33G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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