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NCV51200MWTXG

Onsemi

NCV51200MWTXG by Onsemi

NCV51200MWTXG by Onsemi is a DDR termination regulator with AEC-Q100 screening. It features a max operating temperature of 125 °C and min operating temperature of -40°C. This small outline, heat sink package is ideal for automotive applications requiring precise voltage regulation.

Median Price

$0.880

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6,795 parts In-Stock

1+ parts

$0.880

100+ parts

$0.499

1k+ parts

$0.446

10k+ parts

$0.408

6,795

$0.880

$0.499

$0.446

$0.408

DigiKey

USA . 2,602 parts In-Stock

1+ parts

$0.880

100+ parts

$0.498

1k+ parts

$0.429

10k+ parts

$0.395

2,602

$0.880

$0.498

$0.429

$0.395

Verical

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.365

12,000

-

-

-

$0.365

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,474 parts In-Stock

1+ parts

$0.912

100+ parts

-

1k+ parts

-

10k+ parts

-

2,474

$0.912

-

-

-

Vyrian

USA . 397 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

397

$0.960

-

-

-

Ozdisan Elektronik

Türkiye . 72 parts In-Stock

1+ parts

$60.490

100+ parts

-

1k+ parts

-

10k+ parts

-

72

$60.490

-

-

-

Flip Electronics

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 569 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

-

10k+ parts

-

569

$0.410

-

-

-

Corphita

USA . 1,451 parts In-Stock

1+ parts

$0.864

100+ parts

-

1k+ parts

-

10k+ parts

-

1,451

$0.864

-

-

-

Corohmni

South Africa . 186 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

186

$0.960

-

-

-

Problanco Electronics

Mexico . 6,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,214

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Kulean Microsystems

USA . 2,848 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,848

-

-

-

-

TANS Electronics

Latvia . 1,701 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,701

-

-

-

-

SupplyDigital Components

Austria . 1,418 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,418

-

-

-

-

UHIMA Technologies

Türkiye . 619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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619

-

-

-

-

GreenTree Electronics

Israel . 72 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

72

-

-

-

-

Overview

Experience the cutting-edge technology of the NCV51200MWTXG by Onsemi, a top-tier manufacturer known for its superior quality and reliability. This product falls under the category of Other Function Regulators, offering a wide range of applications. With its innovative design and advanced features, this regulator ensures optimal performance and efficiency. Customers can trust in the value and benefits that this product brings, making it an essential component for their projects. Elevate your systems with the NCV51200MWTXG and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures a lightweight and durable construction, making the product ideal for applications where weight and durability are important factors.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

The AEC-Q100 screening level signifies the product's high reliability and suitability for automotive applications, meeting stringent industry standards.

Package Shape: SQUARE

The square package shape offers a compact design, maximizing space efficiency on the circuit board and facilitating easy integration into various electronic devices.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of lead contamination and is environmentally friendly, making the product a sustainable choice for green initiatives.

Packing Method: TR

The TR packing method ensures secure and organized storage of the regulators, simplifying inventory management and minimizing the risk of damage during transportation.

No. of Terminals: 10

The 10 terminals provide ample connection points for interfacing with other components, allowing for versatile and flexible circuit configurations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance in demanding environments with elevated temperatures, enhancing product longevity.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting, allowing for compact circuit layouts and space-saving designs in electronic systems.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable operation even in harsh cold conditions, making the product suitable for a wide range of temperature environments.

Regulator Type: DDR TERMINATION REGULATOR

The DDR termination regulator type is specifically designed for applications requiring precise voltage regulation and termination functions, ensuring optimal performance in DDR memory systems.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring robust electrical connections and long-term reliability in various operating conditions.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting orientation, allowing for easy integration into different circuit layouts and enhancing ease of installation.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm minimizes the overall profile of the product, making it ideal for space-constrained applications where height restrictions are a concern.

Width: 3 mm

The compact width of 3 mm ensures a slim profile, optimizing space utilization on the circuit board and enabling sleek and space-efficient product designs.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature allows for efficient and reliable soldering processes, ensuring consistent and high-quality connections during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C enables robust solder joints with excellent thermal and mechanical properties, enhancing the product's overall reliability and performance.

Length: 3 mm

The short length of 3 mm contributes to the product's compact form factor, making it suitable for space-constrained applications where size optimization is critical.

Technical Specifications

Other Function Regulators NCV51200MWTXG attributes and parameters. Explore more Other Function Regulators devices from Onsemi

Specs

JESD-30 Code:

S-PDSO-N10

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Regulator Type:

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NCV51200MWTXG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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