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NCV51400MNTXG

Onsemi

NCV51400MNTXG by Onsemi

NCV51400MNTXG by Onsemi is a DDR termination regulator with AEC-Q100 screening. It features a max operating temperature of 125 °C and min operating temperature of -40°C. This small outline, heat sink package is ideal for automotive applications requiring precise voltage regulation.

Median Price

$0.764

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,961 parts In-Stock

1+ parts

$0.960

100+ parts

$0.550

1k+ parts

$0.475

10k+ parts

$0.437

2,961

$0.960

$0.550

$0.475

$0.437

Mouser Electronics

USA . 2,870 parts In-Stock

1+ parts

$0.960

100+ parts

$0.550

1k+ parts

$0.475

10k+ parts

$0.442

2,870

$0.960

$0.550

$0.475

$0.442

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.547

1k+ parts

$0.454

10k+ parts

$0.405

3,000

-

$0.547

$0.454

$0.405

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.567

10k+ parts

$0.506

3,000

-

-

$0.567

$0.506

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 761 parts In-Stock

1+ parts

$0.425

100+ parts

-

1k+ parts

-

10k+ parts

-

761

$0.425

-

-

-

Vyrian

USA . 2,117 parts In-Stock

1+ parts

$0.447

100+ parts

-

1k+ parts

-

10k+ parts

-

2,117

$0.447

-

-

-

Flip Electronics

USA . 19,697 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,697

-

-

-

-

Rebound Electronics

UK . 123 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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123

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,319 parts In-Stock

1+ parts

$0.402

100+ parts

-

1k+ parts

-

10k+ parts

-

2,319

$0.402

-

-

-

Corohmni

South Africa . 473 parts In-Stock

1+ parts

$0.447

100+ parts

-

1k+ parts

-

10k+ parts

-

473

$0.447

-

-

-

Problanco Electronics

Mexico . 8,183 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,183

-

-

-

-

Kulean Microsystems

USA . 6,058 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,058

-

-

-

-

SupplyDigital Components

Austria . 4,825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,825

-

-

-

-

TANS Electronics

Latvia . 3,562 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,562

-

-

-

-

UHIMA Technologies

Türkiye . 415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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415

-

-

-

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Kepictronics

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100

-

-

-

-

Overview

Discover the cutting-edge NCV51400MNTXG by Onsemi, a top-of-the-line DDR termination regulator that stands out for its unparalleled quality and reliability. Crafted by the renowned manufacturer Onsemi, this innovative product offers customers exceptional value and benefits. With a compact design and advanced features, it is ideal for a wide range of applications in various industries. Trust Onsemi to deliver superior performance and efficiency with the NCV51400MNTXG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection, making the regulator suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and enhancing overall design flexibility.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability, making the regulator ideal for automotive applications where stringent standards must be met.

Package Shape: SQUARE

Square package shape facilitates easier PCB layout and component placement, optimizing overall system design.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of soldering issues and promotes a cleaner production process.

Packing Method: TR

TR packing method provides convenient reel packaging for automated assembly processes, increasing efficiency and ease of handling.

No. of Terminals: 10

10 terminals allow for versatile connectivity options, enabling the regulator to be used in a variety of circuit configurations.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enhances thermal management and overall performance, making it suitable for high power applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even under elevated temperature conditions, increasing the regulator's durability and lifespan.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high density mounting, saving board space and allowing for compact designs.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C allows the regulator to function effectively in cold environments, expanding its usability range.

Regulator Type: DDR TERMINATION REGULATOR

DDR termination regulator type is specifically designed for DDR memory applications, ensuring stable and accurate voltage regulation for memory modules.

Terminal Position: DUAL

Dual terminal position provides additional flexibility in circuit connections and layout, accommodating various design requirements.

Maximum Seated Height: 1 mm

Low maximum seated height of 1mm minimizes the overall profile of the regulator, making it suitable for space-constrained applications.

Width: 3 mm

Compact width of 3mm allows for slim and efficient PCB integration, enabling the regulator to be used in size-critical designs.

Length: 3 mm

Short length of 3mm contributes to the overall compactness of the regulator, facilitating easy placement and assembly in tight spaces.

Technical Specifications

Other Function Regulators NCV51400MNTXG attributes and parameters. Explore more Other Function Regulators devices from Onsemi

Specs

JESD-30 Code:

S-PDSO-N10

Length:

3 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Regulator Type:

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

NCV51400MNTXG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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