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NCS2554DTBR2G

Onsemi

NCS2554DTBR2G by Onsemi

NCS2554DTBR2G by Onsemi is a consumer IC with 14 terminals in a small outline package. It operates b/w -40 to 85 °C, with supply voltage ranging from 4.7V to 5.3V. This IC is ideal for industrial applications requiring a compact design and high reliability.

Median Price

$0.377

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 698 parts In-Stock

1+ parts

$0.150

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-

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698

$0.150

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Rochester

USA . 11,275 parts In-Stock

1+ parts

-

100+ parts

$0.370

1k+ parts

$0.307

10k+ parts

$0.274

11,275

-

$0.370

$0.307

$0.274

DigiKey

USA . 11,275 parts In-Stock

1+ parts

-

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$0.460

10k+ parts

-

11,275

-

-

$0.460

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Verical

USA . 8,775 parts In-Stock

1+ parts

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-

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$0.384

10k+ parts

$0.342

8,775

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-

$0.384

$0.342

Distributors (In-Stock)

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Digiode

USA . 2,416 parts In-Stock

1+ parts

$0.142

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2,416

$0.142

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Chip Stock

USA . 55,000 parts In-Stock

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55,000

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Vyrian

USA . 8,413 parts In-Stock

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8,413

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Distributors (Availability)

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Corphita

USA . 2,259 parts In-Stock

1+ parts

$0.135

100+ parts

-

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2,259

$0.135

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Corohmni

South Africa . 128 parts In-Stock

1+ parts

$0.150

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128

$0.150

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Vigor

Singapore . 672 parts In-Stock

1+ parts

$0.290

100+ parts

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672

$0.290

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AZTECH Wire

Italy . 617 parts In-Stock

1+ parts

$21.150

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617

$21.150

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Continental Prestige Electronics

USA . 11,275 parts In-Stock

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$0.231

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11,275

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$0.231

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Kulean Microsystems

USA . 4,869 parts In-Stock

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4,869

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SupplyDigital Components

Austria . 4,722 parts In-Stock

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4,722

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TANS Electronics

Latvia . 4,262 parts In-Stock

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4,262

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UHIMA Technologies

Türkiye . 459 parts In-Stock

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459

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Problanco Electronics

Mexico . 263 parts In-Stock

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263

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Kepictronics

USA . 233 parts In-Stock

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233

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Microchip USA

USA . 229 parts In-Stock

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229

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Overview

Discover the Onsemi NCS2554DTBR2G, a top-of-the-line consumer IC designed to elevate your electronic projects to new heights. With Onsemi's reputation for quality and innovation, this product guarantees reliability and performance like no other. Ideal for a wide range of applications, from industrial to consumer circuits, this compact and versatile IC offers unparalleled value and efficiency. Trust Onsemi to deliver cutting-edge technology that exceeds your expectations. Choose the NCS2554DTBR2G for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the IC, making it suitable for consumer electronics that may be subject to regular handling.

Surface Mount: YES

Surface mount design allows for easy and efficient mounting on circuit boards, saving space and facilitating automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape makes the IC easy to handle and integrate into various electronic devices.

No. of Terminals: 14

Having 14 terminals allows for more connections and functionality in the circuit, making this IC versatile for different applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand heat generated during operation, increasing its reliability and lifespan.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the IC can function in a wide range of environments, making it suitable for industrial use.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides good conductivity and corrosion resistance, ensuring stable connections and long-term performance.

Width: 4.4 mm

The compact width of the IC allows for space-saving integration in tight electronic designs.

Minimum Supply Voltage (Vsup): 4.7 V

The low minimum supply voltage requirement makes this IC energy-efficient and suitable for battery-operated devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures, this IC can withstand harsh environmental conditions in industrial settings, ensuring reliability under demanding conditions.

Technical Specifications

Other Function Consumer ICs NCS2554DTBR2G attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.3 V

Minimum Supply Voltage (Vsup):

4.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

NCS2554DTBR2G General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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