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NCP717AMX330TCG

Onsemi

NCP717AMX330TCG by Onsemi

NCP717AMX330TCG by Onsemi is a Fixed Positive Single Output LDO Regulator with a Nominal Output Voltage of 3.3V and Max Output Current of 0.3A. It operates in an extended temperature range from -40 to 125 °C, making it suitable for various applications requiring stable voltage regulation in compact spaces. This surface-mount device features a small outline package style with very thin profile, ideal for space-constrained designs where efficiency and reliability are crucial.

Median Price

$1.050

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

$1.050

100+ parts

$0.346

1k+ parts

$0.204

10k+ parts

-

3,000

$1.050

$0.346

$0.204

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,147 parts In-Stock

1+ parts

$0.998

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-

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1,147

$0.998

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Vyrian

USA . 7,521 parts In-Stock

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7,521

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Flip Electronics

USA . 3,500 parts In-Stock

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3,500

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Distributors (Availability)

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Corphita

USA . 494 parts In-Stock

1+ parts

$0.945

100+ parts

-

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494

$0.945

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Corohmni

South Africa . 374 parts In-Stock

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$1.050

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-

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374

$1.050

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AZTECH Wire

Italy . 384 parts In-Stock

1+ parts

$10.760

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384

$10.760

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Perfect Parts

USA . 24,864 parts In-Stock

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24,864

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SupplyDigital Components

Austria . 8,263 parts In-Stock

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8,263

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Kulean Microsystems

USA . 7,792 parts In-Stock

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7,792

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

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3,000

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Problanco Electronics

Mexico . 810 parts In-Stock

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810

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Microchip USA

USA . 276 parts In-Stock

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276

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TANS Electronics

Latvia . 44 parts In-Stock

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44

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UHIMA Technologies

Türkiye . 18 parts In-Stock

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18

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Overview

Experience the reliability and efficiency of Onsemi's NCP717AMX330TCG fixed regulator. With a focus on quality and precision, Onsemi delivers top-notch products that exceed industry standards. This regulator is perfect for a variety of applications, providing a stable output voltage with minimal dropout. Customers can trust in the durability and performance of this product, making it an essential component for any project that requires a reliable power source. Trust Onsemi to deliver the best in class solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the regulator lightweight and durable, ideal for a wide range of applications.

Maximum Dropout Voltage-1: 1.23 V

With a low maximum dropout voltage, this regulator can regulate the output voltage even when the input voltage is close to the desired output voltage.

Surface Mount: YES

Being surface mountable makes installation and assembly of this regulator easy and efficient.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this regulator can function reliably in a wide range of environmental conditions.

Nominal Output Voltage-1: 3.3 V

The 3.3V output voltage makes this regulator suitable for powering a variety of electronic devices and circuits.

Maximum Output Current-1: 0.3 A

Capable of delivering up to 0.3A of current, this regulator can power medium to low power devices effectively.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP717AMX330TCG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.23 V

Nominal Dropout Voltage-1:

.155 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

1.8 V

JESD-30 Code:

S-PDSO-N4

Length:

1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.3 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

3.234 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC4,.04,25

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

.43 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

1 mm

Trade Compliance

NCP717AMX330TCG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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