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NCP694DADJHT1G

Onsemi

NCP694DADJHT1G by Onsemi

NCP694DADJHT1G by Onsemi is an adjustable positive single output LDO regulator with a max output current of 1A and a max dropout voltage of 0.32V. It operates in temperatures ranging from -40 to 85 °C, making it suitable for various applications requiring precise voltage regulation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,349 parts In-Stock

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Digiode

USA . 843 parts In-Stock

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843

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AZTECH Wire

Italy . 1,206 parts In-Stock

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$9.400

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SupplyDigital Components

Austria . 6,043 parts In-Stock

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Problanco Electronics

Mexico . 5,245 parts In-Stock

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Kulean Microsystems

USA . 2,078 parts In-Stock

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TANS Electronics

Latvia . 1,747 parts In-Stock

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Perfect Parts

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Corphita

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Vigor

Singapore . 500 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 390 parts In-Stock

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UHIMA Technologies

Türkiye . 47 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NCP694DADJHT1G by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality adjustable regulators that provide reliable power management solutions for various applications. Whether you're working on consumer electronics, automotive systems, or industrial equipment, this product offers superior efficiency and stability. With its compact design and adjustable features, the NCP694DADJHT1G ensures optimal power output while maintaining a low dropout voltage. Upgrade your projects with the best in class regulator from Onsemi and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, making it suitable for various applications.

Maximum Dropout Voltage: 1.32 V

The low maximum dropout voltage ensures efficient power conversion, making the regulator suitable for applications where minimal power loss is crucial.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB mounting, saving space and simplifying the assembly process.

Operating Temperature (TJ-Max): 85 °C

The wide operating temperature range up to 85 °C ensures the regulator's reliability in various environmental conditions.

Technology: CMOS

The CMOS technology used in the regulator enables low power consumption and high efficiency, making it suitable for battery-powered devices.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing PCB layouts, providing flexibility in design.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable solder connections, ensuring proper electrical contact and stability.

Operating Temperature (TJ-Min): -40 °C

The low minimum operating temperature of -40 °C ensures the regulator's functionality even in harsh cold environments.

Packing Method: TR

The TR packing method provides convenient packaging for handling, storing, and transporting the regulators effectively.

Minimum Output Voltage: 1 V

The minimum output voltage of 1V allows for powering a wide range of low voltage applications, making the regulator versatile.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO NCP694DADJHT1G attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.32 V

Nominal Dropout Voltage-1:

.56 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

4.5 mm

Maximum Line Regulation (%/V):

.2

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

1 A

Maximum Output Voltage-1:

5.5 V

Minimum Output Voltage-1:

1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.1,60

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

NCP694DADJHT1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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