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NCP694HADJHT1G

Onsemi

NCP694HADJHT1G by Onsemi

NCP694HADJHT1G by Onsemi is an adjustable positive single output LDO regulator with a max output current of 1A and a max dropout voltage of 0.32V. It operates in temperatures ranging from -40 to 85 °C, making it suitable for various applications requiring precise voltage regulation in compact spaces.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Chip Stock

USA . 9,955 parts In-Stock

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Vyrian

USA . 4,302 parts In-Stock

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$1.274

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$1.159

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$1.045

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350

$1.274

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AZTECH Wire

Italy . 595 parts In-Stock

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$21.790

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RC Electronics

USA . 93,390 parts In-Stock

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Problanco Electronics

Mexico . 8,261 parts In-Stock

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TANS Electronics

Latvia . 5,928 parts In-Stock

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Kepictronics

USA . 4,675 parts In-Stock

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SupplyDigital Components

Austria . 3,402 parts In-Stock

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Microchip USA

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Türkiye . 153 parts In-Stock

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Overview

Unlock the power of precise voltage regulation with the NCP694HADJHT1G by Onsemi. Crafted with superior quality and expertise, this adjustable positive single output LDO regulator provides unmatched stability and efficiency for a wide range of applications. Whether you're designing consumer electronics or industrial machinery, this compact and versatile regulator ensures optimal performance every time. Trust in Onsemi to deliver innovative solutions that elevate your projects to new heights. Elevate your designs with the NCP694HADJHT1G and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring a long lifespan.

Maximum Dropout Voltage-1: 1.32 V

Low dropout voltage ensures efficient voltage regulation and minimal power loss, making it suitable for applications where power efficiency is crucial.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Operating Temperature (TJ-Max): 85 °C

High maximum operating temperature allows for reliable performance in a wide range of environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor, enabling easy placement on the PCB and maximizing space utilization.

Terminal Form: GULL WING

Gull wing terminals make soldering and connection secure and reliable, enhancing the overall durability and stability of the product.

Operating Temperature (TJ-Min): -40 °C

Low minimum operating temperature ensures the product can operate in harsh cold environments without compromising performance.

Minimum Output Voltage-1: 1 V

Low minimum output voltage makes the product suitable for applications requiring low voltage operation, providing flexibility in usage.

No. of Terminals: 5

With five terminals, the product offers versatile connectivity options and compatibility with various circuit configurations.

Maximum Line Regulation (%/V): 0.2

Low maximum line regulation ensures stable output voltage despite fluctuations in input voltage, ensuring consistent performance.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it ideal for applications where size constraints are a consideration.

Adjustability: ADJUSTABLE

The adjustable feature allows for customization of the output voltage, making the product versatile and adaptable to different requirements.

Terminal Pitch: 1.5 mm

The small terminal pitch enables compact and efficient design layouts, contributing to overall space-saving benefits.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

This regulator type provides precise voltage regulation with low noise and high efficiency, making it suitable for a wide range of applications.

Terminal Finish: TIN

Tin terminal finish ensures good conductivity and corrosion resistance, enhancing the reliability and longevity of the product.

Terminal Position: DUAL

Dual terminal position allows for flexible connection options, accommodating different circuit layouts and configurations.

Maximum Output Voltage-1: 5.5 V

High maximum output voltage expands the product's applicability to various voltage requirements, offering versatility in usage.

Maximum Seated Height: 1.6 mm

Low seated height enables a slim profile for the product, facilitating compact and space-saving PCB designs.

Width: 2.5 mm

Narrow width allows for efficient placement on the PCB, optimizing space utilization and enabling dense circuit designs.

Maximum Output Current-1: 1 A

High maximum output current capability allows the product to power devices with higher current requirements, enhancing its versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for an extended period, ensuring reliable soldering and assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the product can undergo reflow soldering processes without performance degradation.

Nominal Dropout Voltage-1: 0.56 V

Low nominal dropout voltage ensures efficient voltage regulation and minimal power loss in various operating conditions.

Length: 4.5 mm

Compact length allows for space-efficient placement on the PCB, contributing to overall PCB design optimization.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO NCP694HADJHT1G attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.32 V

Nominal Dropout Voltage-1:

.56 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

4.5 mm

Maximum Line Regulation (%/V):

.2

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

1 A

Maximum Output Voltage-1:

5.5 V

Minimum Output Voltage-1:

1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.1,60

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

NCP694HADJHT1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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