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NCP694HSANADJT1G

Onsemi

NCP694HSANADJT1G by Onsemi

NCP694HSANADJT1G by Onsemi is an adjustable positive single output LDO regulator with a max output current of 1A and a max dropout voltage of 0.32V. It operates in temperatures ranging from -40 °C to 85°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 7,564 parts In-Stock

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Digiode

USA . 846 parts In-Stock

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Vigor

Singapore . 612 parts In-Stock

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$0.740

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612

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AZTECH Wire

Italy . 759 parts In-Stock

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$11.130

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Kulean Microsystems

USA . 6,878 parts In-Stock

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TANS Electronics

Latvia . 5,490 parts In-Stock

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Kepictronics

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SupplyDigital Components

Austria . 2,729 parts In-Stock

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Corphita

USA . 2,057 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 418 parts In-Stock

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Corohmni

South Africa . 242 parts In-Stock

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Problanco Electronics

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Microchip USA

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Overview

Unlock new possibilities with the NCP694HSANADJT1G from Onsemi, a leading manufacturer in adjustable regulators. This compact and efficient LDO is perfect for a wide range of applications, offering precise voltage control and minimal dropout voltage. With its advanced CMOS technology and adjustable output, this regulator ensures reliable performance in any environment. Trust Onsemi for quality products that deliver unmatched value and benefits to your projects. Elevate your designs with the NCP694HSANADJT1G and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the regulator.

Maximum Dropout Voltage-1: 1.32 V

This low dropout voltage ensures efficient power conversion and minimal power loss.

Surface Mount: YES

Ease of installation and space-saving design for compact electronic devices.

Operating Temperature (TJ-Max): 85 °C

Suitable for a wide range of operating temperatures, ensuring reliable performance in various environments.

Technology: CMOS

Efficient and low power consumption technology for improved energy efficiency.

Package Shape: RECTANGULAR

Compact and easy to integrate into electronic circuits.

Terminal Form: NO LEAD

Environmentally friendly and compliant with RoHS regulations.

Operating Temperature (TJ-Min): -40 °C

Capable of operating in low temperature environments without compromising performance.

Packing Method: TR

Tray packaging for convenient storage and handling during manufacturing processes.

Minimum Output Voltage-1: 1 V

Provides a stable and reliable output voltage for powering electronic components.

No. of Terminals: 6

Sufficient number of terminals for connectivity and flexibility in circuit design.

Maximum Line Regulation (%/V): 0.2

Ensures consistent output voltage even with varying input voltage levels.

Package Style (Meter): SMALL OUTLINE

Space-saving design for compact electronic devices.

Adjustability: ADJUSTABLE

Allows for customization of the output voltage to suit specific requirements.

Terminal Pitch: 0.95 mm

Close terminal pitch for efficient and compact layout in circuit designs.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

Designed for precision voltage regulation with low dropout voltage for efficient power conversion.

Terminal Finish: TIN

Provides good electrical conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position for flexible mounting options in circuit layouts.

Maximum Output Voltage-1: 5.5 V

Provides a wide range of output voltage options for powering various electronic components.

Maximum Seated Height: 0.9 mm

Low profile design for space-saving and compact electronic devices.

Width: 2.8 mm

Compact width for easy integration into small electronic devices.

Maximum Output Current-1: 1 A

High output current capability for powering a range of electronic components.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High temperature tolerance for reliable soldering and manufacturing processes.

Nominal Dropout Voltage-1: 0.56 V

Low dropout voltage for efficient power conversion and minimal power loss.

Length: 2.9 mm

Compact length for easy integration into electronic circuits.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO NCP694HSANADJT1G attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.32 V

Nominal Dropout Voltage-1:

.56 V

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

2.9 mm

Maximum Line Regulation (%/V):

.2

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

1 A

Maximum Output Voltage-1:

5.5 V

Minimum Output Voltage-1:

1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.8 mm

Trade Compliance

NCP694HSANADJT1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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