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NCP583SQ18T1G

Onsemi

NCP583SQ18T1G by Onsemi

NCP583SQ18T1G by Onsemi is a Fixed Positive Single Output LDO Regulator with 1.8V Nominal Output Voltage, 0.75V Max Dropout Voltage, and 0.18A Max Output Current. It is ideal for applications requiring stable voltage regulation in compact electronic devices due to its small outline package and low dropout voltage.

Median Price

$0.400

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Voyager Components

USA . 6,000 parts In-Stock

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$0.400

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$0.400

Chip Stock

USA . 50,000 parts In-Stock

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Vyrian

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PC Components Company LLC

USA . 3,000 parts In-Stock

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Bristol Electronics

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Netsource Technology, Inc.

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Digiode

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Corohmni

South Africa . 106 parts In-Stock

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AZTECH Wire

Italy . 490 parts In-Stock

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$20.990

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Perfect Parts

USA . 31,647 parts In-Stock

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Assy Fe

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Problanco Electronics

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TANS Electronics

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SupplyDigital Components

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Kulean Microsystems

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Futuretech Components

Singapore . 685 parts In-Stock

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Corphita

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UHIMA Technologies

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Kepictronics

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Microchip USA

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Overview

Discover the NCP583SQ18T1G by Onsemi, a top-of-the-line Fixed Regulator that guarantees superior quality and reliability. With a wide range of applications, this LDO regulator stands out for its exceptional performance and efficiency. Offering precise output voltage control and high accuracy, this product ensures optimal power management in various electronic devices. Get ready to experience seamless operation and enhanced functionality with the NCP583SQ18T1G - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the regulator easy to handle and resistant to damage.

Maximum Dropout Voltage-1: 0.75 V

Low dropout voltage ensures efficiency and minimal power loss in the circuit.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology provides low power consumption and stable output voltage, making it suitable for battery-operated devices.

Package Shape: RECTANGULAR

Rectangular shape allows for space-saving and efficient PCB layout.

Terminal Form: GULL WING

Gull wing terminals ensure secure and reliable soldering connections on the PCB.

Operating Temperature (TJ-Min): -40 °C

Wide temperature range enables operation in harsh environments without compromising performance.

Minimum Output Voltage-1: 1.728 V

Stable and precise minimum output voltage ensures proper functioning of connected devices.

Maximum Voltage Tolerance: 2 %

Tight voltage tolerance ensures consistent and accurate output voltage regulation.

Nominal Output Voltage-1: 1.8 V

Stable nominal output voltage suitable for a wide range of electronic applications.

No. of Terminals: 4

Provides sufficient connection points for easy integration into the circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Compact and slim package style takes up minimal space on the PCB, ideal for space-constrained applications.

Adjustability: FIXED

Fixed output voltage eliminates the need for external adjustments, simplifying circuit design.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance even in elevated temperature conditions.

Terminal Pitch: 1.3 mm

Optimal terminal pitch for easy and secure soldering on the PCB.

Maximum Line Regulation: 0.01332 %

Low line regulation ensures stable output voltage despite variations in input voltage.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme cold conditions.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

LDO regulator delivers stable and precise output voltage with low dropout, ideal for sensitive electronics.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout options.

Maximum Output Voltage-1: 1.872 V

Precise maximum output voltage suitable for powering a variety of electronic components.

Maximum Seated Height: 1.1 mm

Low profile design with maximum seated height for compact and space-saving PCB assembly.

Width: 1.25 mm

Narrow width enables close placement of components on the PCB for efficient layout.

Maximum Load Regulation: 0.04 %

Low load regulation ensures stable output voltage under varying load conditions.

Minimum Input Voltage: 1.7 V

Wide input voltage range ensures compatibility with various power sources.

Maximum Output Current-1: 0.18 A

Sufficient output current for powering moderate to low power consumption devices.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for safe and reliable soldering during PCB assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust soldering process.

Nominal Dropout Voltage-1: 0.5 V

Low dropout voltage ensures efficient power conversion with minimal loss.

Length: 2 mm

Compact length for space-efficient PCB layout.

Maximum Input Voltage: 6 V

Wide input voltage range suitable for various power supply sources.

Maximum Input Voltage Absolute: 6.5 V

Allows for an extra margin of safety in case of voltage spikes or fluctuations.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP583SQ18T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.75 V

Nominal Dropout Voltage-1:

.5 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

1.7 V

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

2 mm

Maximum Line Regulation:

.01332 %

Maximum Load Regulation:

.04 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.18 A

Maximum Output Voltage-1:

1.872 V

Minimum Output Voltage-1:

1.728 V

Nominal Output Voltage-1:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

1.25 mm

Trade Compliance

NCP583SQ18T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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