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NCP582DSQ18T1G

Onsemi

NCP582DSQ18T1G by Onsemi

NCP582DSQ18T1G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 1.8V and max output current of 0.2A. It operates in an extended temperature range from -40 to 125 °C, making it suitable for various applications requiring stable voltage regulation in compact spaces. The package style is small outline, thin profile, with surface mount capability for easy integration into electronic designs.

Median Price

$0.201

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 36 parts In-Stock

1+ parts

-

100+ parts

$0.201

1k+ parts

$0.167

10k+ parts

$0.148

36

-

$0.201

$0.167

$0.148

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,527 parts In-Stock

1+ parts

$0.155

100+ parts

-

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10k+ parts

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1,527

$0.155

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Vyrian

USA . 9,570 parts In-Stock

1+ parts

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9,570

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Semi Source

USA . 144 parts In-Stock

1+ parts

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144

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Prism Electronics

USA . 30 parts In-Stock

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30

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Distributors (Availability)

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Corphita

USA . 1,396 parts In-Stock

1+ parts

$0.147

100+ parts

-

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1,396

$0.147

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Vigor

Singapore . 418 parts In-Stock

1+ parts

$0.160

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418

$0.160

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Corohmni

South Africa . 344 parts In-Stock

1+ parts

$0.163

100+ parts

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344

$0.163

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AZTECH Wire

Italy . 449 parts In-Stock

1+ parts

$16.380

100+ parts

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449

$16.380

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Problanco Electronics

Mexico . 6,096 parts In-Stock

1+ parts

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6,096

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Kulean Microsystems

USA . 3,781 parts In-Stock

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3,781

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Perfect Parts

USA . 3,338 parts In-Stock

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3,338

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SupplyDigital Components

Austria . 2,505 parts In-Stock

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2,505

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Microchip USA

USA . 435 parts In-Stock

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435

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TANS Electronics

Latvia . 348 parts In-Stock

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348

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UHIMA Technologies

Türkiye . 215 parts In-Stock

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215

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Overview

Discover exceptional performance and reliability with the NCP582DSQ18T1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality in fixed regulators like this Positive Single Output LDO. Perfect for a wide range of applications, this product offers customers incredible value with its precise voltage regulation, minimal dropout voltage, and efficient operation even in extreme temperatures. Trust Onsemi to provide you with the best solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring that the product is easy to handle and offers long-term reliability.

Maximum Dropout Voltage: 1.55 V

The low dropout voltage of 1.55V ensures efficient regulation of the output voltage even when the input voltage is close to the output voltage, making this product suitable for applications where precise voltage regulation is required.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on printed circuit boards, saving time and space in electronic designs.

Operating Temperature (TJ-Max): 125 °C

The high operating temperature range of up to 125 °C ensures that the regulator can function reliably in a wide range of environmental conditions.

Technology: CMOS

The CMOS technology used in this regulator provides high efficiency, low power consumption, and stable operation, making it ideal for battery-powered and low-power applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into electronic designs and efficient use of board space.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections to the circuit board, ensuring stable performance and ease of assembly.

Operating Temperature (TJ-Min): -40 °C

The low operating temperature range of -40 °C allows for reliable operation even in extreme cold environments.

Packing Method: TR

The TR packing method ensures that the product is securely stored and protected during transportation and storage, reducing the risk of damage.

Minimum Output Voltage: 1.764 V

The minimum output voltage of 1.764V ensures that the regulator can provide a stable and precise output voltage even at low loads, making it suitable for a wide range of applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP582DSQ18T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.55 V

Nominal Dropout Voltage-1:

.32 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2 V

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

2 mm

Maximum Line Regulation:

.0067 %

Maximum Load Regulation:

.04 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Maximum Output Voltage-1:

1.836 V

Minimum Output Voltage-1:

1.764 V

Nominal Output Voltage-1:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOT-343R

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

1.25 mm

Trade Compliance

NCP582DSQ18T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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