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NCP561SN33T1

Onsemi

NCP561SN33T1 by Onsemi

NCP561SN33T1 by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.15A. It has a small outline package style, operates b/w -40 to 125 °C, and is suitable for applications requiring low dropout voltage and precise voltage regulation in compact designs.

Median Price

$0.159

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20 parts In-Stock

1+ parts

-

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$0.159

1k+ parts

$0.132

10k+ parts

$0.117

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$0.159

$0.132

$0.117

Avnet

USA . 20 parts In-Stock

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20

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Digiode

USA . 2,225 parts In-Stock

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$0.124

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$0.124

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Vyrian

USA . 4,459 parts In-Stock

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Corphita

USA . 586 parts In-Stock

1+ parts

$0.117

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586

$0.117

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Vigor

Singapore . 898 parts In-Stock

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$0.120

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898

$0.120

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Corohmni

South Africa . 310 parts In-Stock

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$0.130

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$0.130

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AZTECH Wire

Italy . 960 parts In-Stock

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$19.710

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960

$19.710

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TANS Electronics

Latvia . 7,567 parts In-Stock

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Problanco Electronics

Mexico . 6,660 parts In-Stock

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Kulean Microsystems

USA . 4,257 parts In-Stock

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SupplyDigital Components

Austria . 3,465 parts In-Stock

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UHIMA Technologies

Türkiye . 390 parts In-Stock

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Microchip USA

USA . 338 parts In-Stock

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338

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Overview

Enhance your electronic designs with the NCP561SN33T1 by Onsemi, a top-tier manufacturer known for quality and reliability. As a leading fixed regulator in the industry, this LDO offers precise voltage regulation, ensuring optimal performance in a variety of applications. From consumer electronics to industrial equipment, this product guarantees stable power supply with minimal dropout voltage. Trust Onsemi's expertise and choose the NCP561SN33T1 for superior efficiency and seamless integration into your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring a long lifespan for the regulator.

Maximum Dropout Voltage: 1.2 V

Low dropout voltage means that the regulator can provide a stable output even when the input voltage is close to the output voltage, ensuring reliable operation.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the regulator onto circuit boards, saving space and simplifying assembly.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this regulator can handle demanding environmental conditions without sacrificing performance.

Nominal Output Voltage: 3.3 V

This common voltage output makes it compatible with a wide range of electronic devices and circuits.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP561SN33T1 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.2 V

Nominal Dropout Voltage-1:

.13 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

4.3 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

Maximum Line Regulation:

.02 %

Maximum Load Regulation:

.06 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

2.234 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

1.5 mm

Trade Compliance

NCP561SN33T1 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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