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NCP552SQ33T1

Onsemi

NCP552SQ33T1 by Onsemi

NCP552SQ33T1 by Onsemi is a CMOS LDO regulator with 3.3V output voltage, 0.08A output current, and 1V dropout voltage. Ideal for applications requiring stable power supply in compact spaces due to its small outline and thin profile package style.

Median Price

$3.031

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 9,365 parts In-Stock

1+ parts

-

100+ parts

$2.170

1k+ parts

$1.470

10k+ parts

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9,365

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$2.170

$1.470

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Verical

USA . 9,350 parts In-Stock

1+ parts

-

100+ parts

$3.892

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9,350

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$3.892

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Distributors (In-Stock)

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Bristol Electronics

USA . 17,282 parts In-Stock

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17,282

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Inventory MP

USA . 14,282 parts In-Stock

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14,282

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Vyrian

USA . 3,336 parts In-Stock

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3,336

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Digiode

USA . 2,407 parts In-Stock

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2,407

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Distributors (Availability)

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Corohmni

South Africa . 59 parts In-Stock

1+ parts

$1.840

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-

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59

$1.840

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AZTECH Wire

Italy . 1,102 parts In-Stock

1+ parts

$11.500

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-

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1,102

$11.500

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Kulean Microsystems

USA . 6,923 parts In-Stock

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6,923

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Problanco Electronics

Mexico . 6,221 parts In-Stock

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6,221

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TANS Electronics

Latvia . 4,300 parts In-Stock

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4,300

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UHIMA Technologies

Türkiye . 972 parts In-Stock

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972

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Corphita

USA . 837 parts In-Stock

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837

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Futuretech Components

Singapore . 686 parts In-Stock

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686

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SupplyDigital Components

Austria . 318 parts In-Stock

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318

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Vigor

Singapore . 145 parts In-Stock

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145

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Overview

Discover the NCP552SQ33T1 by Onsemi, a top-quality fixed voltage regulator that offers reliable performance and efficiency. Manufactured by Onsemi, a trusted name in the industry, this LDO regulator is versatile and ideal for a variety of applications. From consumer electronics to industrial equipment, this product provides stable power output with minimal dropout voltage, ensuring optimal functionality. With a compact design and high-quality materials, the NCP552SQ33T1 is a valuable solution that delivers consistent results, making it a must-have for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the regulator.

Maximum Dropout Voltage-1: 1 V

Low dropout voltage ensures efficient regulation and minimal power loss, making it suitable for low voltage applications.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying the manufacturing process.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range enables reliable performance in various environmental conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high efficiency, ideal for battery-powered devices.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy integration into existing PCB layouts and designs.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable electrical connections during installation.

Minimum Output Voltage-1: 3.201 V

Stable minimum output voltage ensures consistent performance under varying load conditions.

Maximum Voltage Tolerance: 3 %

Tight voltage tolerance ensures precise regulation of output voltage, suitable for applications requiring high accuracy.

Nominal Output Voltage-1: 3.3 V

Standard output voltage suitable for a wide range of electronic devices and circuits.

No. of Terminals: 4

Compact design with a minimum number of terminals simplifies installation and reduces complexity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Small and slim package design saves space on PCBs, making it ideal for compact electronic devices.

Terminal Pitch: 1.3 mm

Optimal terminal pitch for easy soldering and mounting on standard PCB layouts.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

A fixed positive output regulator with low dropout voltage and high accuracy for stable power supply in various applications.

Terminal Finish: TIN LEAD

Tin lead finish ensures good solderability and reliable electrical connections during assembly.

Terminal Position: DUAL

Dual terminal position offers flexibility in installation orientation, accommodating different PCB layouts.

Maximum Output Voltage-1: 3.399 V

Maximum output voltage within tight tolerance ensures reliable performance under load variations.

Maximum Seated Height: 1.1 mm

Low seated height enables easy integration into compact electronic devices with height constraints.

Width: 1.25 mm

Narrow width allows for efficient use of PCB space and facilitates compact device designs.

Minimum Input Voltage: 4.3 V

Wide input voltage range accommodates various power sources, ensuring compatibility with different electronic systems.

Maximum Output Current-1: 0.08 A

Suitable maximum output current for low power applications, providing stable power supply for connected components.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during assembly process, contributing to the overall quality and durability of the product.

Peak Reflow Temperature °C: 235

High peak reflow temperature capability for efficient and reliable soldering during manufacturing.

Length: 2 mm

Compact length allows for efficient use of PCB space and facilitates miniaturized product designs.

Maximum Input Voltage: 12 V

Wide input voltage range accommodates various power sources, ensuring flexibility and compatibility with different applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP552SQ33T1 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

1 V

Maximum Input Voltage:

12 V

Minimum Input Voltage:

4.3 V

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Maximum Output Current-1:

.08 A

Maximum Output Voltage-1:

3.399 V

Minimum Output Voltage-1:

3.201 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

1.25 mm

Trade Compliance

NCP552SQ33T1 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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