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NCP508MT18TBG

Onsemi

NCP508MT18TBG by Onsemi

NCP508MT18TBG by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 1.8V and max dropout voltage of 0.3V, suitable for applications requiring stable voltage regulation in compact spaces. With a small outline and very thin profile package style, it offers precise line and load regulation with an operating temperature range from -40 °C to 125°C, making it ideal for various electronic devices.

Median Price

$0.164

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 51,477 parts In-Stock

1+ parts

-

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$0.155

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$0.129

10k+ parts

$0.115

51,477

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$0.155

$0.129

$0.115

DigiKey

USA . 51,477 parts In-Stock

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-

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$0.190

51,477

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$0.190

Verical

USA . 29,059 parts In-Stock

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$0.143

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$0.143

Farnell

UK . 17,621 parts In-Stock

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$0.174

17,621

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$0.174

Distributors (In-Stock)

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Digiode

USA . 563 parts In-Stock

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$0.168

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563

$0.168

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Chip Stock

USA . 65,000 parts In-Stock

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Vyrian

USA . 7,075 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,056 parts In-Stock

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$0.159

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2,056

$0.159

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Corohmni

South Africa . 144 parts In-Stock

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$0.174

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144

$0.174

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AZTECH Wire

Italy . 284 parts In-Stock

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$10.340

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284

$10.340

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Continental Prestige Electronics

USA . 17,621 parts In-Stock

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$0.150

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17,621

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$0.150

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QUARKTWIN TECHNOLOGY LTD

USA . 11,255 parts In-Stock

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Kulean Microsystems

USA . 4,270 parts In-Stock

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Problanco Electronics

Mexico . 1,791 parts In-Stock

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TANS Electronics

Latvia . 1,790 parts In-Stock

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SupplyDigital Components

Austria . 977 parts In-Stock

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UHIMA Technologies

Türkiye . 502 parts In-Stock

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Microchip USA

USA . 126 parts In-Stock

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Overview

Experience the superior quality and reliability of Onsemi with the NCP508MT18TBG, a Fixed Regulator that offers a stable output voltage for your applications. With a compact design and high efficiency, this LDO regulator is perfect for various electronic devices. Enjoy peace of mind knowing that this product provides consistent performance and precise voltage regulation. Trust in Onsemi's expertise to deliver exceptional value and benefits to meet your power management needs. Invest in the NCP508MT18TBG for unmatched performance and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the regulator, ensuring a longer lifespan.

Maximum Dropout Voltage-1: 1.3 V

With a low dropout voltage, this regulator can maintain a stable output voltage even when the input voltage is close to the output voltage, providing reliable performance.

Surface Mount: YES

Being surface mountable makes it easier to integrate this regulator into compact electronic devices, saving space and simplifying the assembly process.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this regulator can withstand challenging environmental conditions, ensuring consistent performance in various applications.

Nominal Output Voltage-1: 1.8 V

The stable output voltage of 1.8V makes this regulator suitable for powering sensitive electronics that require a precise voltage supply.

Maximum Voltage Tolerance: 3 %

The tight voltage tolerance ensures that the output voltage remains within the specified range, providing consistent power delivery to the connected components.

Maximum Output Current-1: 0.05 A

While not a high current output, this regulator is ideal for low power applications where a steady and regulated voltage is needed.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP508MT18TBG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.3 V

Nominal Dropout Voltage-1:

.155 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

12 V

Minimum Input Voltage:

2.746 V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

1.5 mm

Maximum Line Regulation:

.02 %

Maximum Load Regulation:

.04 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.05 A

Maximum Output Voltage-1:

1.854 V

Minimum Output Voltage-1:

1.746 V

Nominal Output Voltage-1:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.06,20

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

1.5 mm

Trade Compliance

NCP508MT18TBG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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