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NCP3231NMNTXG

Onsemi

NCP3231NMNTXG by Onsemi

NCP3231NMNTXG by Onsemi is a 40-terminal switching controller with voltage-mode control, operating b/w -40 to 90 °C. It features a buck switcher configuration, PWM control technique, and max switching frequency of 550 kHz. Ideal for industrial applications requiring precise voltage regulation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,678 parts In-Stock

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Digiode

USA . 1,150 parts In-Stock

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AZTECH Wire

Italy . 1,101 parts In-Stock

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$16.320

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Component Stockers USA

USA . 501 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 8,240 parts In-Stock

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Kulean Microsystems

USA . 4,708 parts In-Stock

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Problanco Electronics

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TANS Electronics

Latvia . 2,629 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 895 parts In-Stock

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Microchip USA

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Overview

Elevate your electronics with the NCP3231NMNTXG by Onsemi. As a leader in Switching Regulators & Controllers, Onsemi delivers top-notch quality products that are reliable and efficient. This compact SQUARE package offers a myriad of applications for various industries. With VOLTAGE-MODE control mode and PULSE WIDTH MODULATION technique, this product ensures optimal performance and stability. Experience the benefits of industrial-grade temperature tolerance, low input voltage requirements, and high switching frequency. Trust Onsemi to provide you with the tools you need to power your innovations.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, providing a compact and efficient design.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the board.

No. of Terminals: 40

Provides a high level of connectivity options for various external components.

Maximum Operating Temperature: 90 °C

Ensures stable performance even in high-temperature environments.

Control Mode: VOLTAGE-MODE

Voltage-mode control technique offers precise regulation and stability.

Minimum Operating Temperature: -40 °C

Operates efficiently in low-temperature conditions as well.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance.

Width (mm): 6 mm

Compact width allows for space-saving integration in tight layouts.

Nominal Input Voltage: 12 V

Suitable for applications requiring a stable 12V input voltage.

Maximum Switching Frequency: 550 kHz

High switching frequency enables efficient power conversion and regulation.

Control Technique: PULSE WIDTH MODULATION

PWM control technique provides fast transient response and precise output voltage regulation.

Switcher Config: BUCK

Buck configuration allows for step-down voltage conversion, suitable for a wide range of applications.

Minimum Input Voltage: 4.5 V

Supports a wide input voltage range for versatile applications.

Maximum Input Voltage: 18 V

Ability to handle input voltages up to 18V provides flexibility in power source selection.

Technical Specifications

Switching Regulators & Controllers NCP3231NMNTXG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

18 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

550 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

NCP3231NMNTXG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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