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NCP3123MNTXG

Onsemi

NCP3123MNTXG by Onsemi

NCP3123MNTXG by Onsemi is a 32-terminal SQUARE CHIP CARRIER with VOLTAGE-MODE control, operating b/w -40 to 125 °C. It supports up to 4.8A output current at 2530 kHz switching frequency, ideal for automotive applications requiring high efficiency and precise voltage regulation.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,897 parts In-Stock

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2,897

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Digiode

USA . 145 parts In-Stock

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145

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Univa Technologies Pte. Ltd

Singapore . 105 parts In-Stock

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105

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AZTECH Wire

Italy . 818 parts In-Stock

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$21.890

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818

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Component Stockers USA

USA . 569 parts In-Stock

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$99.990

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569

$99.990

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SupplyDigital Components

Austria . 5,323 parts In-Stock

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Perfect Parts

USA . 5,126 parts In-Stock

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USA . 4,000 parts In-Stock

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4,000

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Problanco Electronics

Mexico . 3,917 parts In-Stock

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Kulean Microsystems

USA . 3,025 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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Kepictronics

USA . 2,200 parts In-Stock

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TANS Electronics

Latvia . 1,796 parts In-Stock

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Microchip USA

USA . 398 parts In-Stock

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Corohmni

South Africa . 253 parts In-Stock

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Corphita

USA . 151 parts In-Stock

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UHIMA Technologies

Türkiye . 115 parts In-Stock

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Univa Technologies Pte. Ltd (Excess)

Singapore . 105 parts In-Stock

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Overview

Experience unparalleled efficiency and reliability with the NCP3123MNTXG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality in their Switching Regulators & Controllers. The NCP3123MNTXG is perfect for a range of applications, offering customers exceptional value with its advanced features and benefits. Trust Onsemi to provide you with a product that exceeds expectations and enhances performance in your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape is compact and efficient, making it suitable for applications where space is limited.

No. of Terminals: 32

Having 32 terminals provides flexibility in connecting various components and peripherals in the circuit.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slub, and very thin profile design helps in efficient heat dissipation and compact packaging.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides precise regulation of output voltage, ensuring stability and efficiency in power management.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 125 °C makes this product suitable for operation in extreme temperature conditions.

Terminal Finish: TIN

Tin terminal finish offers good solderability and corrosion resistance, enhancing the reliability of connections.

Terminal Position: QUAD

Quad terminal position allows for easy connectivity and integration with other components on the circuit board.

Maximum Seated Height: 1 mm

Low seated height enables a compact and space-saving design, ideal for applications with stringent size constraints.

Width (mm): 5 mm

The narrow width of 5mm ensures compatibility with standard PCB layouts and facilitates efficient PCB design.

Other IC type: DUAL SWITCHING CONTROLLER

Having a dual switching controller allows for more sophisticated control and management of power delivery, improving overall performance.

Nominal Input Voltage: 12 V

The 12V nominal input voltage is commonly used in many applications, making this product versatile and widely compatible.

Maximum Switching Frequency: 2530 kHz

High switching frequency enables fast and efficient power conversion, reducing energy loss and improving overall efficiency.

Maximum Output Current: 4.8 A

The high maximum output current of 4.8A allows for powering a wide range of devices and components with sufficient power capacity.

Temperature Grade: AUTOMOTIVE

Being automotive-grade ensures reliability and durability in harsh automotive environments, making it suitable for automotive applications.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique provides precise control over output voltage and current, contributing to efficient power management.

Switcher Config: PHASE-SHIFT

Phase-shift switcher configuration helps in reducing electromagnetic interference and improving efficiency in power conversion.

Minimum Input Voltage: 4.5 V

Low minimum input voltage of 4.5V allows for operation in systems with lower voltage requirements, increasing versatility.

Maximum Input Voltage: 13.2 V

High maximum input voltage of 13.2V provides flexibility in power supply options, accommodating a wide range of input voltages.

Technical Specifications

Switching Regulators & Controllers NCP3123MNTXG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

13.2 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

4.8 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Maximum Switching Frequency:

2530 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

NCP3123MNTXG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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