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NCP3102CMNTXG

Onsemi

NCP3102CMNTXG by Onsemi

NCP3102CMNTXG by Onsemi is a 40-terminal SQUARE CHIP CARRIER with VOLTAGE-MODE control mode, ideal for AUTOMOTIVE applications. It operates b/w -40 to 125 °C, supports BUCK switcher config, and has a max switching frequency of 317 kHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,835 parts In-Stock

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Digiode

USA . 465 parts In-Stock

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465

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AZTECH Wire

Italy . 608 parts In-Stock

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$11.840

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608

$11.840

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Kulean Microsystems

USA . 2,959 parts In-Stock

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Microchip USA

USA . 2,670 parts In-Stock

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Corphita

USA . 1,118 parts In-Stock

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TANS Electronics

Latvia . 957 parts In-Stock

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UHIMA Technologies

Türkiye . 896 parts In-Stock

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SupplyDigital Components

Austria . 894 parts In-Stock

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Problanco Electronics

Mexico . 730 parts In-Stock

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Corohmni

South Africa . 278 parts In-Stock

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Overview

Experience superior performance and reliability with the Onsemi NCP3102CMNTXG switching regulator. Crafted by a renowned manufacturer in the industry, this innovative product offers unparalleled quality and efficiency for a wide range of applications. With its advanced features and cutting-edge technology, this versatile chip carrier package ensures optimal power management and control. Trust Onsemi to deliver exceptional value and benefits, providing customers with the advantage they need to stay ahead in today's competitive market. Elevate your projects with the NCP3102CMNTXG and experience the difference that superior engineering can make.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on PCBs, making it suitable for compact and space-constrained applications.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and easy integration into designs.

No. of Terminals: 40

Having 40 terminals provides flexibility in connecting various components and peripherals, enabling customization and versatility in applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal conductivity, efficient heat dissipation, and compact size for high-density designs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance.

Control Mode: VOLTAGE-MODE

The voltage-mode control technique allows for accurate voltage regulation, stable output, and enhanced system efficiency.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables this product to function reliably in cold environments, expanding its usability in a wide range of applications.

Terminal Finish: TIN

TIN terminal finish offers good solderability, durability against environmental factors, and reliable electrical connections.

Terminal Position: QUAD

The quad terminal position facilitates easy mounting and integration, allowing for efficient PCB layout and manufacturing processes.

Maximum Seated Height: 1.2 mm

With a low seated height, this product can be used in slim devices and compact spaces, contributing to space-saving and sleek designs.

Width (mm): 4.4 mm

The compact width of 4.4 mm allows for high-density integration and efficient space utilization in electronic systems and applications.

Other IC type: SWITCHING REGULATOR

Being a switching regulator, this product offers high efficiency, low power dissipation, and precise voltage regulation for optimized performance.

Nominal Input Voltage: 12 V

With a nominal input voltage of 12 V, this product is well-suited for applications requiring stable and regulated power supply at this voltage level.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this product can withstand high-temperature soldering processes, ensuring robust solder joints and reliability.

Length: 5 mm

The compact length of 5 mm allows for easy integration into space-constrained designs while maintaining functionality and performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets the stringent temperature requirements and reliability standards for automotive electronics.

Maximum Switching Frequency: 317 kHz

The high maximum switching frequency of 317 kHz enables fast response, efficiency, and precise control in voltage regulation and power management.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination, offers environmental benefits, and ensures compliance with RoHS regulations.

Control Technique: PULSE WIDTH MODULATION

Using pulse width modulation as the control technique allows for adjustable duty cycles, accurate voltage regulation, and enhanced efficiency in power conversion.

Switcher Config: BUCK

With a buck switcher configuration, this product can step down voltage efficiently, providing stable and regulated output voltage for various electronic devices.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables high-density mounting, precise connections, and efficient PCB layout, suitable for compact electronic designs.

Moisture Sensitivity Level (MSL): 3

Having MSL level 3 indicates moderate sensitivity to moisture, requiring appropriate handling and storage conditions to maintain product integrity and reliability.

Minimum Input Voltage: 4.5 V

The minimum input voltage of 4.5 V allows for operation in low-voltage conditions, making this product versatile and suitable for a wide range of power supply applications.

Maximum Input Voltage: 13.2 V

With a maximum input voltage of 13.2 V, this product can handle higher voltage levels for applications requiring stable power supply and voltage regulation.

Technical Specifications

Switching Regulators & Controllers NCP3102CMNTXG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

13.2 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

317 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

NCP3102CMNTXG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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