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NCP3064BPG

Onsemi

NCP3064BPG by Onsemi

NCP3064BPG by Onsemi is a switching regulator with 1.5A output current, 190kHz switching frequency, and -40 to 125 °C operating temperature range. Ideal for automotive applications due to its hysteric current mode control technique and buck-boost switcher configuration in an 8-terminal rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,407 parts In-Stock

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Digiode

USA . 1,583 parts In-Stock

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AZTECH Wire

Italy . 268 parts In-Stock

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$15.920

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Problanco Electronics

Mexico . 7,530 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 4,492 parts In-Stock

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Kulean Microsystems

USA . 3,018 parts In-Stock

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SupplyDigital Components

Austria . 1,755 parts In-Stock

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Vigor

Singapore . 934 parts In-Stock

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Corphita

USA . 665 parts In-Stock

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Microchip USA

USA . 391 parts In-Stock

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UHIMA Technologies

Türkiye . 272 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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Corohmni

South Africa . 85 parts In-Stock

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Overview

Discover the NCP3064BPG by Onsemi, a high-quality switching regulator that offers reliable performance and efficiency. Onsemi is known for its innovative solutions in the field of power management, ensuring top-notch quality and durability. Ideal for a wide range of applications, this product provides customers with exceptional value by delivering stable output currents and precise control mode operation. Say goodbye to power fluctuations and hello to seamless power management with the NCP3064BPG. Choose Onsemi for superior technology you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Control Mode: CURRENT-MODE

Current-mode control allows for improved transient response and better noise immunity.

Maximum Output Current: 1.5 A

Capable of providing up to 1.5A output current, making it suitable for a variety of applications.

Nominal Input Voltage: 5 V

Designed to operate efficiently with a nominal input voltage of 5V.

Maximum Switching Frequency: 190 kHz

High switching frequency of 190 kHz allows for smaller external components and efficient operation.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature ranges, ensuring reliability in harsh environments.

Technical Specifications

Switching Regulators & Controllers NCP3064BPG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

HYSTERETIC CURRENT MODE

Maximum Input Voltage:

40 V

Minimum Input Voltage:

3 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.78 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

190 kHz

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

NCP3064BPG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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