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NCP3063

Onsemi

NCP3063 by Onsemi

NCP3063 by Onsemi is a current-mode switching regulator with 1.5A output, 190kHz frequency, and buck-boost configuration. It operates b/w 0 to 70 °C, suitable for commercial applications requiring efficient power management in compact spaces. The IC's small outline package with dual terminals and matte tin finish makes it ideal for surface-mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,493 parts In-Stock

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Vyrian

USA . 2,262 parts In-Stock

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LittleDiode

UK . 42 parts In-Stock

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SupplyDigital Components

Austria . 7,410 parts In-Stock

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Kulean Microsystems

USA . 5,914 parts In-Stock

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TANS Electronics

Latvia . 5,589 parts In-Stock

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Problanco Electronics

Mexico . 4,150 parts In-Stock

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Corphita

USA . 1,257 parts In-Stock

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Corohmni

South Africa . 323 parts In-Stock

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UHIMA Technologies

Türkiye . 291 parts In-Stock

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Perfect Parts

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Overview

Discover the innovative NCP3063 by Onsemi, a top-of-the-line switching regulator that guarantees exceptional quality and reliability. With a sleek square package shape and small outline design, this product is perfect for a variety of applications. From efficient power management to voltage regulation, the NCP3063 offers customers unmatched value and benefits. Trust in Onsemi's expertise in manufacturing cutting-edge solutions and elevate your projects with the superior performance of the NCP3063.

Feature Benefit Bullets

Surface Mount: YES

Enables easy and efficient mounting onto PCBs, saving space and facilitating automated assembly processes.

Package Shape: SQUARE

Square shape allows for a compact design, making it suitable for applications where space is limited.

No. of Terminals: 8

Provides sufficient connection points for versatile integration into electronic circuits.

Maximum Operating Temperature: 70 °C

Capable of operating under moderate to high temperature conditions, ensuring reliability in various environments.

Control Mode: CURRENT-MODE

Current-mode control offers fast response and superior load regulation, optimizing performance.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for long-term durability.

Maximum Output Current: 1.5 A

High output current capability enables the regulator to support power-hungry components or subsystems.

Minimum Input Voltage: 5 V

Low minimum input voltage requirement makes it suitable for applications where power sources may vary.

Technical Specifications

Switching Regulators & Controllers NCP3063 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

HYSTERETIC CURRENT MODE

Maximum Input Voltage:

40 V

Minimum Input Voltage:

5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

4 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

1.5 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

190 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width (mm):

4 mm

Trade Compliance

NCP3063 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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