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NCP1800DM41R2

Onsemi

NCP1800DM41R2 by Onsemi

NCP1800DM41R2 by Onsemi is a switching regulator with 2.5-16V power supplies, -20 to 85 °C operating temperature range, and 8 terminals in a small outline package. Ideal for battery charge control applications due to its current-mode control, 0.02A output current, and compact design.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 2,276 parts In-Stock

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Digiode

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R&J Components

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AZTECH Wire

Italy . 1,063 parts In-Stock

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Problanco Electronics

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TANS Electronics

Latvia . 6,355 parts In-Stock

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SupplyDigital Components

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Vigor

Singapore . 455 parts In-Stock

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Corohmni

South Africa . 418 parts In-Stock

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UHIMA Technologies

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Microchip USA

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Corphita

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Kulean Microsystems

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Overview

Enhance your power supply designs with the NCP1800DM41R2 by Onsemi. As a leading manufacturer in switching regulators & controllers, Onsemi delivers top-quality products for various applications. This small outline, thin profile package offers superior performance with a wide input voltage range of 2.5V to 16V, making it versatile for different projects. With a current-mode control mode and gull wing terminal form, this battery charge controller ensures efficient power management. Invest in the NCP1800DM41R2 for reliable solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, ensuring a reliable and long-lasting product.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Package Shape: SQUARE

Facilitates compact and space-saving design, ideal for applications where size is a constraint.

Power Supplies (V): 2.5/16

Wide input voltage range allows for versatility in powering various devices and applications.

No. of Terminals: 8

Sufficient terminals for connectivity and functionality, ensuring compatibility with different circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Streamlined package design for reduced board space and improved thermal performance, enhancing overall efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures stable performance under challenging environmental conditions.

Control Mode: CURRENT-MODE

Current-mode control offers advantages such as improved transient response and simplified compensation, enhancing overall regulation efficiency.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows for reliable operation even in colder environments, increasing the product's versatility.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity, ensuring secure connections for consistent performance.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit layout and connection options, accommodating various installation requirements.

Maximum Seated Height: 1.1 mm

Low seated height contributes to a compact and slim form factor, suitable for applications where space is limited.

Width (mm): 3 mm

Narrow width allows for efficient placement on a PCB, optimizing board layout and space utilization.

Other IC type: BATTERY CHARGE CONTROLLER

Integrates battery charge control functionality, making it an all-in-one solution for power management applications.

Nominal Input Voltage: 6 V

Specific nominal input voltage for reliable and optimized performance, ensuring compatibility with various power sources.

Peak Reflow Temperature °C: 235

High peak reflow temperature tolerance for robust soldering processes, ensuring secure and durable connections during assembly.

Length: 3 mm

Compact length contributes to a space-saving design, ideal for applications with size constraints.

Maximum Supply Current (Isup): 0.25 mA

Low maximum supply current for efficient power consumption, enhancing energy efficiency and reducing operating costs.

Maximum Output Current: 0.02 A

Specific maximum output current rating for safe and reliable power delivery to connected loads.

Terminal Form: GULL WING

Gull wing terminal form for easy and secure mounting on a PCB, ensuring reliable electrical connections.

Switcher Config: SINGLE

Single switcher configuration simplifies the overall design and operation, enhancing reliability and ease of implementation.

Terminal Pitch: 0.65 mm

Fine terminal pitch for precise and secure connections, contributing to overall product reliability and performance.

Minimum Input Voltage: 2.5 V

Low minimum input voltage requirement for compatibility with a wide range of power sources, increasing the product's versatility.

Maximum Input Voltage: 16 V

High maximum input voltage tolerance for compatibility with various power sources, ensuring reliable operation in different environments.

Technical Specifications

Switching Regulators & Controllers NCP1800DM41R2 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Maximum Input Voltage:

16 V

Minimum Input Voltage:

2.5 V

Nominal Input Voltage:

6 V

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.02 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/16

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.25 mA

Surface Mount:

YES

Switcher Config:

SINGLE

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

NCP1800DM41R2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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