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NCP1595MNT2G

Onsemi

NCP1595MNT2G by Onsemi

NCP1595MNT2G by Onsemi is a current-mode switching regulator with 6.1A output current, 1130kHz max switching frequency, and 1.2V nominal output voltage. Ideal for industrial applications requiring efficient power management in a compact square package with surface mount capability.

Median Price

$3.060

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 8,100 parts In-Stock

1+ parts

$3.060

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8,100

$3.060

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DF Sales Co.

USA . 8,100 parts In-Stock

1+ parts

$3.060

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8,100

$3.060

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Vyrian

USA . 2,990 parts In-Stock

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2,990

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Digiode

USA . 142 parts In-Stock

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142

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Distributors (Availability)

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Corohmni

South Africa . 240 parts In-Stock

1+ parts

$3.060

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240

$3.060

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AZTECH Wire

Italy . 932 parts In-Stock

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$8.460

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932

$8.460

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Component Stockers USA

USA . 761 parts In-Stock

1+ parts

$99.990

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761

$99.990

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Problanco Electronics

Mexico . 6,718 parts In-Stock

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6,718

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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SupplyDigital Components

Austria . 4,527 parts In-Stock

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4,527

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Kulean Microsystems

USA . 3,518 parts In-Stock

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3,518

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TANS Electronics

Latvia . 1,945 parts In-Stock

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1,945

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Corphita

USA . 933 parts In-Stock

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933

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Microchip USA

USA . 156 parts In-Stock

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156

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UHIMA Technologies

Türkiye . 91 parts In-Stock

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91

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Overview

Unlock the potential of your electronic designs with the NCP1595MNT2G by Onsemi. As a leader in switching regulators & controllers, Onsemi brings you a product that guarantees top-notch quality and reliability. This versatile device is perfect for a wide range of applications, offering a compact design, high efficiency, and precise control. Say goodbye to power supply issues and hello to smooth, uninterrupted performance with the NCP1595MNT2G. Experience the Onsemi advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for portable applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient assembly onto circuit boards, saving space and reducing overall product size.

Package Shape: SQUARE

The square package shape makes it easy to integrate into tight spaces or densely packed designs, maximizing board space utilization.

No. of Terminals: 6

Having 6 terminals provides flexibility in connecting the product to other components or devices, allowing for versatile design options.

Control Mode: CURRENT-MODE

The current-mode control mode offers efficient regulation and stability in controlling the output current, leading to reliable performance.

Nominal Input Voltage: 5 V

The nominal input voltage of 5V makes it compatible with a wide range of power sources, enhancing product compatibility and usability.

Maximum Output Current: 6.1 A

The high maximum output current of 6.1A allows for powering a variety of components or devices, making it suitable for demanding applications.

Technical Specifications

Switching Regulators & Controllers NCP1595MNT2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4 V

Nominal Input Voltage:

5 V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

6.1 A

Nominal Output Voltage:

1.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1130 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

NCP1595MNT2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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