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NCP1450ASN33T1G

Onsemi

NCP1450ASN33T1G by Onsemi

NCP1450ASN33T1G by Onsemi is a VOLTAGE-MODE switching controller with 216 kHz max frequency and 0.15 A output current. It operates b/w -40 to 85 °C, ideal for industrial applications requiring compact design and precise voltage control. Package style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH.

Median Price

$15.820

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 1 parts In-Stock

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$15.820

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Digiode

USA . 1,618 parts In-Stock

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$15.029

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Vyrian

USA . 8,136 parts In-Stock

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AZTECH Wire

Italy . 356 parts In-Stock

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$9.600

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$13.450

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Corphita

USA . 1,175 parts In-Stock

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$14.238

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Corohmni

South Africa . 83 parts In-Stock

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Kepictronics

USA . 15,000 parts In-Stock

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Benley Electronics

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TANS Electronics

Latvia . 2,894 parts In-Stock

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RC Electronics

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 1,147 parts In-Stock

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SupplyDigital Components

Austria . 885 parts In-Stock

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UHIMA Technologies

Türkiye . 875 parts In-Stock

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Perfect Parts

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Vigor

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Microchip USA

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Overview

Discover the power of efficiency and reliability with the NCP1450ASN33T1G by Onsemi. This high-quality switching regulator provides unparalleled performance in a compact package, making it ideal for a wide range of applications. With Onsemi's reputation for excellence in manufacturing, you can trust that this product delivers consistent results every time. Say goodbye to inefficiency and hello to seamless operation with the NCP1450ASN33T1G - the perfect solution for all your voltage regulation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the product on circuit boards, saving space and simplifying assembly processes.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product is suitable for industrial applications where temperature fluctuations are common.

Nominal Input Voltage: 5 V

The nominal input voltage of 5V makes this product compatible with a wide range of applications and power sources.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique allows for precise control over output voltage and current, improving efficiency and performance of the product.

Technical Specifications

Switching Regulators & Controllers NCP1450ASN33T1G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

216 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP1450ASN33T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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