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NCP1402SN40T1G

Onsemi

NCP1402SN40T1G by Onsemi

NCP1402SN40T1G by Onsemi is a small outline switching regulator with 5 terminals. It operates b/w -40 to 85°C, suitable for industrial applications. Features include voltage-mode control, boost configuration, and pulse frequency modulation technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,617 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Digiode

USA . 80 parts In-Stock

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80

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Modulus Dynamics

Lithuania . 3,103 parts In-Stock

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$2.645

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$2.645

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$2.645

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3,103

$2.645

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Ampacity Inc.

Singapore . 563 parts In-Stock

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$3.500

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563

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Semicontronic

India . 344 parts In-Stock

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$4.500

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$4.388

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$4.365

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344

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Aztec Data Supply Inc.

USA . 4,703 parts In-Stock

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$5.310

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$5.310

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AZTECH Wire

Italy . 357 parts In-Stock

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$18.022

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Component Stockers USA

USA . 343 parts In-Stock

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$99.990

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Lixinc

USA . 8,038 parts In-Stock

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Problanco Electronics

Mexico . 7,075 parts In-Stock

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Continental Prestige Electronics

USA . 6,098 parts In-Stock

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SupplyDigital Components

Austria . 5,774 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,045 parts In-Stock

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TANS Electronics

Latvia . 4,367 parts In-Stock

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Argo Parts USA

USA . 3,750 parts In-Stock

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Corphita

USA . 2,410 parts In-Stock

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Kulean Microsystems

USA . 1,172 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Vigor

Singapore . 282 parts In-Stock

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Microchip USA

USA . 269 parts In-Stock

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UHIMA Technologies

Türkiye . 205 parts In-Stock

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Corohmni

South Africa . 147 parts In-Stock

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Advanced Electronics

New Zealand . 70 parts In-Stock

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Kepictronics

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Overview

Experience the superior quality of the NCP1402SN40T1G by Onsemi, a leading manufacturer in the industry of switching regulators & controllers. This small outline, thin profile device offers a wide range of applications with its voltage-mode control mode and pulse frequency modulation technology. With a maximum output current of 0.4A and a minimum input voltage of 0.95V, this product provides exceptional efficiency and reliability for industrial-grade operations. Trust Onsemi's expertise and innovation to deliver high-performance solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for portable electronic devices.

Surface Mount: YES

With surface mounting capability, this product offers easy installation and space-saving benefits in compact circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration into various electronic assemblies.

No. of Terminals: 5

The presence of 5 terminals allows for versatile connections and configurations to suit different circuit requirements.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style ensures space efficiency and enhanced heat dissipation for optimal performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand extended usage in demanding industrial environments.

Control Mode: VOLTAGE-MODE

The voltage-mode control technique offers precise regulation and efficiency in managing the input voltage for consistent performance.

Minimum Operating Temperature: -40 °C

The wide temperature range allows this product to operate reliably in extreme cold conditions without compromising functionality.

Terminal Finish: TIN

The use of tin terminal finish ensures good conductivity, corrosion resistance, and solderability for reliable circuit connections.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and enhance the stability of electrical connections for improved reliability.

Technical Specifications

Switching Regulators & Controllers NCP1402SN40T1G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE FREQUENCY MODULATION

Maximum Input Voltage:

6 V

Minimum Input Voltage:

.95 V

Nominal Input Voltage:

6 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP1402SN40T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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