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NCP1341B4D1R2G

Onsemi

NCP1341B4D1R2G by Onsemi

NCP1341B4D1R2G by Onsemi is a current-mode switching controller with a max operating temperature of 125 °C. It has a nominal input voltage of 12V and supports automotive applications. With a compact rectangular package style, it offers resonant control and operates at a max switching frequency of 25 kHz.

Median Price

$31.080

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,300 parts In-Stock

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$31.080

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2,300

$31.080

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Distributors (In-Stock)

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Digiode

USA . 631 parts In-Stock

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$29.526

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631

$29.526

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Chip Stock

USA . 8,830 parts In-Stock

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8,830

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NAC Semi

USA . 5,000 parts In-Stock

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$1.020

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$1.020

Vyrian

USA . 551 parts In-Stock

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551

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Distributors (Availability)

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Vigor

Singapore . 428 parts In-Stock

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$0.470

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428

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Microchip USA

USA . 3,986 parts In-Stock

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$4.047

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3,986

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AZTECH Wire

Italy . 551 parts In-Stock

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$21.210

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551

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Corphita

USA . 1,300 parts In-Stock

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$27.972

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$27.972

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Corohmni

South Africa . 268 parts In-Stock

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$31.080

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268

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Perfect Parts

USA . 10,640 parts In-Stock

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TANS Electronics

Latvia . 5,359 parts In-Stock

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SupplyDigital Components

Austria . 4,703 parts In-Stock

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Problanco Electronics

Mexico . 3,866 parts In-Stock

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GreenTree Electronics

Israel . 2,400 parts In-Stock

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2,400

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Authorized Procurement Solutions

USA . 2,300 parts In-Stock

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Kulean Microsystems

USA . 879 parts In-Stock

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UHIMA Technologies

Türkiye . 865 parts In-Stock

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Overview

Unlock the power of efficient energy management with the NCP1341B4D1R2G by Onsemi. This switching regulator and controller offers unmatched quality and reliability, perfect for a wide range of applications. From automotive to industrial, this small outline package provides optimal performance in a compact design. Say goodbye to inefficient energy usage and hello to cost savings with this innovative solution. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the regulator, making it suitable for various operating environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and enabling mass production.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this regulator can withstand harsh conditions and maintain stable performance.

Control Mode: CURRENT-MODE

Current-mode control ensures precise regulation of output current, improving efficiency and stability of the regulator.

Nominal Input Voltage: 12 V

With a nominal input voltage of 12V, this regulator is suitable for applications where a stable voltage supply is required.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this regulator meets the stringent requirements for temperature and performance in vehicles.

Maximum Switching Frequency: 25 kHz

High switching frequency allows for fast response to load changes and helps reduce the size of external components, enhancing overall efficiency.

Technical Specifications

Switching Regulators & Controllers NCP1341B4D1R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

RESONANT CONTROL

Maximum Input Voltage:

28 V

Minimum Input Voltage:

9 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G9

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2 mm

Surface Mount:

YES

Maximum Switching Frequency:

25 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP1341B4D1R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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