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NCP1339JDR2G

Onsemi

NCP1339JDR2G by Onsemi

NCP1339JDR2G by Onsemi is a current-mode switching controller with a max operating temperature of 125 °C. It has a nominal input voltage of 12V and supports resonant control technique. This automotive-grade IC is ideal for applications requiring efficient power management in compact spaces.

Median Price

$0.758

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 52 parts In-Stock

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$0.628

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$0.597

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Rochester

USA . 371 parts In-Stock

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-

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$0.889

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$0.738

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$0.658

371

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$0.889

$0.738

$0.658

Verical

USA . 353 parts In-Stock

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$1.111

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353

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Chip1Stop

Japan . 55 parts In-Stock

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$0.325

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$0.325

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Digiode

USA . 1,362 parts In-Stock

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$0.324

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Vyrian

USA . 2,467 parts In-Stock

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Bristol Electronics

USA . 2,354 parts In-Stock

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Dan-Mar Components

USA . 2,354 parts In-Stock

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Microfarads

USA . 42 parts In-Stock

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Corphita

USA . 1,640 parts In-Stock

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$0.307

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$0.307

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Corohmni

South Africa . 178 parts In-Stock

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$0.325

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Component Stockers USA

USA . 346 parts In-Stock

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$0.340

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$0.710

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346

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$0.710

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Ampacity Inc.

Singapore . 181 parts In-Stock

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$0.600

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Vigor

Singapore . 651 parts In-Stock

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$0.700

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$0.700

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AZTECH Wire

Italy . 1,144 parts In-Stock

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$15.760

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Kepictronics

USA . 5,517 parts In-Stock

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TANS Electronics

Latvia . 3,688 parts In-Stock

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Kulean Microsystems

USA . 1,599 parts In-Stock

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UHIMA Technologies

Türkiye . 898 parts In-Stock

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Microchip USA

USA . 423 parts In-Stock

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Continental Prestige Electronics

USA . 371 parts In-Stock

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$0.662

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Problanco Electronics

Mexico . 215 parts In-Stock

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SupplyDigital Components

Austria . 137 parts In-Stock

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Perfect Parts

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Overview

Experience the superior quality and reliability of Onsemi with the NCP1339JDR2G, a cutting-edge switching regulator and controller designed to meet the demands of various applications. This innovative product offers customers unmatched value and benefits, delivering efficient performance and precise control. Whether you're looking for automotive solutions or industrial applications, this versatile device will exceed your expectations. Trust Onsemi to provide you with the best in class technology for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the switching regulator, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy and secure installation on PCBs, saving space and simplifying the assembly process.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stability and performance even in demanding environmental conditions.

Control Mode: CURRENT-MODE

Current-mode control offers superior transient response and improved noise immunity, enhancing the overall efficiency of the switching regulator.

Nominal Input Voltage: 12 V

The specific input voltage compatibility makes this switching regulator suitable for applications requiring a nominal 12V power source.

Maximum Switching Frequency: 25 kHz

The high switching frequency enables efficient power conversion and regulation, resulting in minimal energy loss and heat generation.

Technical Specifications

Switching Regulators & Controllers NCP1339JDR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

CONFIGURED AS FLYBACK TOPOLOGY

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

RESONANT CONTROL

Maximum Input Voltage:

28 V

Minimum Input Voltage:

10 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G13

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

13

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Maximum Switching Frequency:

25 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP1339JDR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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