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NCP1338DR2G

Onsemi

NCP1338DR2G by Onsemi

NCP1338DR2G by Onsemi is a switching controller with max output current of 1A and max switching frequency of 130kHz. It operates in automotive grade temperature range (-40 to 125 °C) and uses pulse width modulation for control. Ideal for applications requiring efficient power management in compact spaces.

Median Price

$0.745

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 4,949 parts In-Stock

1+ parts

$0.745

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-

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4,949

$0.745

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Distributors (In-Stock)

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Digiode

USA . 1,632 parts In-Stock

1+ parts

$0.708

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-

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1,632

$0.708

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Vyrian

USA . 2,900 parts In-Stock

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2,900

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,949 parts In-Stock

1+ parts

$0.316

100+ parts

-

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4,949

$0.316

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Corphita

USA . 771 parts In-Stock

1+ parts

$0.670

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771

$0.670

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Corohmni

South Africa . 302 parts In-Stock

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$0.745

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302

$0.745

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Vigor

Singapore . 258 parts In-Stock

1+ parts

$1.630

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258

$1.630

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AZTECH Wire

Italy . 933 parts In-Stock

1+ parts

$17.520

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933

$17.520

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$21.423

100+ parts

$19.495

1k+ parts

$17.567

10k+ parts

-

2,500

$21.423

$19.495

$17.567

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Perfect Parts

USA . 60,043 parts In-Stock

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60,043

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Kepictronics

USA . 7,700 parts In-Stock

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7,700

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SupplyDigital Components

Austria . 5,533 parts In-Stock

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5,533

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Kulean Microsystems

USA . 4,353 parts In-Stock

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4,353

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Problanco Electronics

Mexico . 4,226 parts In-Stock

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4,226

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TANS Electronics

Latvia . 1,970 parts In-Stock

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1,970

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UHIMA Technologies

Türkiye . 233 parts In-Stock

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233

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Microchip USA

USA . 168 parts In-Stock

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168

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Overview

Discover the power of the NCP1338DR2G by Onsemi, a cutting-edge switching regulator and controller designed for various applications. Manufactured by Onsemi, a leader in the industry known for their top-quality products, this device ensures optimal performance and reliability. With a compact design and advanced features like current-mode control and pulse width modulation, this product offers unparalleled efficiency and precision. Whether you're looking to enhance your automotive systems or upgrade your electronics, the NCP1338DR2G provides the value, benefits, and advantages you need to take your projects to the next level. Experience the difference with Onsemi's NCP1338DR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and resistance to heat, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Control Mode: CURRENT-MODE

Current-mode control provides efficient regulation and stability in managing current flow.

Nominal Input Voltage: 11 V

Suitable for applications requiring a nominal input voltage of 11V, ensuring compatibility with various power sources.

Maximum Output Current: 1 A

Capable of delivering up to 1A output current, making it suitable for a range of devices with different power requirements.

Maximum Switching Frequency: 130 kHz

High switching frequency allows for quick and efficient power conversion, improving overall performance.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature range, ensuring reliable operation in harsh conditions.

Technical Specifications

Switching Regulators & Controllers NCP1338DR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

18.6 V

Minimum Input Voltage:

11 V

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDSO-G7

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP7/8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

130 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP1338DR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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