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NCP1308DR2G

Onsemi

NCP1308DR2G by Onsemi

NCP1308DR2G by Onsemi is a switching controller with current-mode control technique. It operates at a max switching frequency of 60 kHz and supports a max output current of 0.5 A. This CMOS technology-based device is ideal for applications requiring efficient power management in compact spaces.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,909 parts In-Stock

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Digiode

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Vigor

Singapore . 477 parts In-Stock

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$0.570

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AZTECH Wire

Italy . 504 parts In-Stock

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$15.420

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Component Stockers USA

USA . 630 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 13,812 parts In-Stock

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Kulean Microsystems

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A-Z Elektronik GmbH

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Problanco Electronics

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SupplyDigital Components

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Perfect Parts

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TANS Electronics

Latvia . 3,937 parts In-Stock

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Kepictronics

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Metaverse IC Inc.

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Corphita

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UHIMA Technologies

Türkiye . 339 parts In-Stock

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Microchip USA

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Overview

Discover the NCP1308DR2G by Onsemi, a top-of-the-line switching regulator that guarantees high-quality performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is designed to meet the needs of various applications in the Switching Regulators & Controllers category. With its compact design and advanced features like current-mode control and pulse width modulation, the NCP1308DR2G offers customers unparalleled value and benefits. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly on circuit boards, saving time and effort during production.

No. of Terminals: 8

Having 8 terminals provides flexibility in connection options, allowing for different configurations and functionalities.

Control Mode: CURRENT-MODE

The current-mode control mode ensures stable and accurate output regulation, making it suitable for applications that require precise current control.

Nominal Input Voltage: 11 V

With a nominal input voltage of 11V, this product is suitable for use in a wide range of devices and systems that operate within this voltage range.

Maximum Output Current: 0.5 A

The maximum output current of 0.5A allows for powering various components and subsystems, making it versatile for different applications.

Maximum Switching Frequency: 60 kHz

A high maximum switching frequency of 60kHz enables efficient power conversion and regulation, making it a reliable choice for fast-switching applications.

Technical Specifications

Switching Regulators & Controllers NCP1308DR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

60 kHz

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP1308DR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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