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NCP1217AD100R2G

Onsemi

NCP1217AD100R2G by Onsemi

NCP1217AD100R2G by Onsemi is a current-mode switching controller with a max output current of 0.5A and a max switching frequency of 110kHz. It is designed for applications requiring pulse width modulation control technique in small outline packages, suitable for surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,492 parts In-Stock

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Chip Stock

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Digiode

USA . 1,532 parts In-Stock

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Vigor

Singapore . 777 parts In-Stock

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$0.600

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777

$0.600

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Component Stockers USA

USA . 38,927 parts In-Stock

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$0.640

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$0.610

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$0.550

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$0.550

38,927

$0.640

$0.610

$0.550

$0.550

Ampacity Inc.

Singapore . 137 parts In-Stock

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$1.500

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137

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AZTECH Wire

Italy . 47 parts In-Stock

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$9.220

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47

$9.220

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Perfect Parts

USA . 23,520 parts In-Stock

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Kepictronics

USA . 20,000 parts In-Stock

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RC Electronics

USA . 14,400 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,036 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,558 parts In-Stock

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TANS Electronics

Latvia . 4,498 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 2,883 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 1,520 parts In-Stock

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Metaverse IC Inc.

Canada . 1,194 parts In-Stock

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Kulean Microsystems

USA . 693 parts In-Stock

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UHIMA Technologies

Türkiye . 318 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 71 parts In-Stock

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Overview

Discover the NCP1217AD100R2G by Onsemi, a cutting-edge switching regulator & controller that offers unparalleled quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this product boasts a small outline package style and matte tin terminal finish for ease of use. Ideal for various applications, this switching controller provides a maximum output current of 0.5A and a maximum switching frequency of 110kHz. Experience the value and benefits of this innovative product, designed to meet your power management needs with precision and efficiency. Elevate your projects with the NCP1217AD100R2G from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good protection and insulation for the internal components of the switching regulator, ensuring reliability and durability.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and enabling efficient assembly of electronic devices.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used in electronic components, making it easier to integrate into various designs and layouts.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting external components and allows for a wide range of input and output configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in saving board space and enables compact designs in electronic devices.

Control Mode: CURRENT-MODE

Current-mode control offers better transient response and improved stability, making the switching regulator more efficient and reliable.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and ensures secure connections during assembly, enhancing the overall reliability of the switching regulator.

Terminal Position: DUAL

Dual terminal position allows for better heat dissipation and improved thermal performance in the switching regulator.

Maximum Seated Height: 1.75 mm

Low seated height makes the switching regulator suitable for compact designs and applications where space is limited.

Width (mm): 3.9 mm

Compact width dimension enables easy integration of the switching regulator into various electronic devices without occupying much space.

Other IC Type: SWITCHING CONTROLLER

Being a switching controller, this IC offers efficient power conversion with high accuracy and performance, making it a reliable choice for power supply designs.

Nominal Input Voltage: 11 V

The nominal input voltage of 11V is suitable for a wide range of applications, providing flexibility in powering different electronic devices.

Maximum Switching Frequency: 110 kHz

High maximum switching frequency allows for efficient power conversion and control, improving the overall performance of the switching regulator.

Maximum Output Current: 0.5 A

With a maximum output current of 0.5A, this switching regulator can power various components and devices within its current rating, offering versatility in application.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and robust performance, making the switching regulator energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form offers easy surface mounting and secure solder connections, enhancing the overall reliability and durability of the switching regulator.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique ensures precise regulation of output voltage, improving efficiency and performance of the switching regulator.

Switcher Config: SINGLE

Single switcher configuration simplifies the design and operation of the switching regulator, making it more cost-effective and easy to integrate into electronic devices.

Terminal Pitch: 1.27 mm

Small terminal pitch enables easy PCB layout and assembly, allowing for compact designs and efficient use of space in electronic devices.

Minimum Input Voltage: 8.3 V

The minimum input voltage of 8.3V ensures compatibility with a wide range of power sources, providing flexibility in powering the switching regulator.

Technical Specifications

Switching Regulators & Controllers NCP1217AD100R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

8.3 V

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

110 kHz

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP1217AD100R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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