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NCP1207AP

Onsemi

NCP1207AP by Onsemi

NCP1207AP by Onsemi is a switching controller with current-mode control technique. It operates b/w -40 to 125 °C and has a max output current of 0.5 A. Widely used in automotive applications due to its CMOS technology and pulse width modulation for efficient power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,731 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 311 parts In-Stock

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Component Stockers USA

USA . 544 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 6,384 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 4,032 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

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Corphita

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UHIMA Technologies

Türkiye . 767 parts In-Stock

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Vigor

Singapore . 697 parts In-Stock

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Corohmni

South Africa . 448 parts In-Stock

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Microchip USA

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Overview

Discover the NCP1207AP by Onsemi, a top-quality switching regulator & controller that offers unparalleled efficiency and reliability. Manufactured by Onsemi, a trusted leader in semiconductor technology, this product is perfect for a wide range of applications. With its current-mode control mode and pulse width modulation technique, the NCP1207AP ensures optimal performance and precision. Whether you need to power automotive systems or industrial equipment, this compact and versatile IC type will exceed your expectations. Experience the superior value and benefits that the NCP1207AP brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the regulator, ensuring long-term reliability.

Control Mode: CURRENT-MODE

Current-mode control offers better dynamic response and stability in regulating the output voltage, making the product efficient and reliable.

Maximum Output Current: 0.5 A

The maximum output current of 0.5A allows for powering a variety of devices within the specified range, making this regulator versatile for different applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this regulator can withstand harsh operating conditions in vehicles, ensuring optimal performance under high temperatures.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique provides efficient power conversion and regulation, improving the overall performance and energy efficiency of the product.

Technical Specifications

Switching Regulators & Controllers NCP1207AP attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

RESONANT CONTROL TECHNIQUE IS ALSO AVAILABLE

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

10.6 V

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Length:

9.78 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP7/8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

SINGLE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

NCP1207AP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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